Patents by Inventor Ryan B. Wicker

Ryan B. Wicker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190039183
    Abstract: A method of forming a crack-free aluminum alloy structure using additive manufacturing is presented. A powder bed of precursor aluminum alloy powder is heated. The crack-free aluminum alloy structure is formed within a laser powder bed fusion system encompassing the powder bed during heating.
    Type: Application
    Filed: August 7, 2018
    Publication date: February 7, 2019
    Inventors: Philip Alexander Morton, Syed Zia Uddin, Ryan B. Wicker, David Espalin, Lawrence Eugene Murr
  • Publication number: 20180079131
    Abstract: Methods, systems, and devices for the manufacture of 3D printed components with structurally integrated metal objects using an additive manufacturing system enhanced with a range of possible secondary embedding processes. One or more layers of a three-dimensional substrate can be created by depositing a substrate, and then one or more 3D printed components can be configured on the substrate with one or more metal objects using additive manufacturing enhanced by one or more secondary embedding processes.
    Type: Application
    Filed: March 14, 2016
    Publication date: March 22, 2018
    Inventors: David Espalin, Eric MacDonald, Ryan B. Wicker
  • Publication number: 20160324009
    Abstract: Systems and methods for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic, or electromechanical component/device.
    Type: Application
    Filed: June 17, 2016
    Publication date: November 3, 2016
    Inventors: Ryan B. Wicker, Franciso Medina, Eric MacDonald, Danny W. Muse
  • Patent number: 9414501
    Abstract: The present invention provides systems and methods for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: August 9, 2016
    Assignee: Board of Regents, The University of Texas System
    Inventors: Ryan B. Wicker, Francisco Medina, Eric MacDonald, Danny W. Muse, David Espalin
  • Publication number: 20140268604
    Abstract: The present invention provides systems and methods for embedding a filament or filament mesh in a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device by providing at least a first layer of a substrate material, and embedding at least a portion of a filament or filament mesh within the first layer of the substrate material such the portion of the filament or filament mesh is substantially flush with a top surface of the first layer and a substrate material in a flowable state is displaced by the portion of the filament and does not substantially protrude above the top surface of the first layer, allowing the continuation of an additive manufacturing process above the embedded filament or filament mesh.
    Type: Application
    Filed: March 14, 2013
    Publication date: September 18, 2014
    Applicant: BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM
    Inventors: Ryan B. Wicker, Francisco Medina, Eric MacDonald, Danny W. Muse, David Espalin
  • Publication number: 20130170171
    Abstract: The present invention provides a system and method for making a three-dimensional electronic, electromagnetic or electromechanical component/device by: (1) creating one or more layers of a three-dimensional substrate by depositing a substrate material in a layer-by-layer fashion, wherein the substrate includes a plurality of interconnection cavities and component cavities; (2) filling the interconnection cavities with a conductive material; and (3) placing one or more components in the component cavities.
    Type: Application
    Filed: January 4, 2012
    Publication date: July 4, 2013
    Applicant: BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM
    Inventors: Ryan B. Wicker, Eric MacDonald, Francisco Medina, David Espalin, Danny W. Muse
  • Patent number: 7419630
    Abstract: A preferred embodiment provides, for example, a system and method of integrating fluid media dispensing technology such as direct-write (DW) technologies with rapid prototyping (RP) technologies such as stereolithography (SL) to provide increased micro-fabrication and micro-stereolithography. A preferred embodiment of the present invention also provides, for example, a system and method for Rapid Prototyping High Density Circuit (RPHDC) manufacturing of solderless connectors and pilot devices with terminal geometries that are compatible with DW mechanisms and reduce contact resistance where the electrical system is encapsulated within structural members and manual electrical connections are eliminated in favor of automated DW traces. A preferred embodiment further provides, for example, a method of rapid prototyping comprising: fabricating a part layer using stereolithography and depositing thermally curable media onto the part layer using a fluid dispensing apparatus.
    Type: Grant
    Filed: April 22, 2005
    Date of Patent: September 2, 2008
    Assignee: Sandia Corporation
    Inventors: Jeremy A. Palmer, Donald W. Davis, Bart D. Chavez, Phillip L. Gallegos, Ryan B. Wicker, Francisco R. Medina
  • Patent number: 7194120
    Abstract: Methods and computer systems for determining the placement of an implant in a patient in need thereof comprising the step of analyzing intensity-based medical imaging data obtained from a patient, isolating an anatomic site of interest from the imaging data, determining anatomic spatial relationships with the use of an algorithm, wherein the algorithm is optionally automated.
    Type: Grant
    Filed: May 29, 2003
    Date of Patent: March 20, 2007
    Assignee: Board of Regents, The University of Texas System
    Inventors: Ryan B. Wicker, Buzuayehu Tedla
  • Publication number: 20040240715
    Abstract: Methods and computer systems for determining the placement of an implant in a patient in need thereof comprising the step of analyzing intensity-based medical imaging data obtained from a patient, isolating an anatomic site of interest from the imaging data, determining anatomic spatial relationships with the use of an algorithm, wherein the algorithm is optionally automated.
    Type: Application
    Filed: May 29, 2003
    Publication date: December 2, 2004
    Inventors: Ryan B. Wicker, Buzuayehu Tedla