Patents by Inventor Ryan Boardman

Ryan Boardman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SYSTEMS AND METHODS FOR COOLING IN A FURNACE
    Publication number: 20250362084
    Abstract: The disclosed technology includes a burner panel including an outer enclosure having an outer surface and an inner surface and a burner enclosure disposed at least partially within the outer enclosure and having an outer surface and an inner surface, wherein the outer surface of the burner enclosure and the inner surface of the outer enclosure define a cooling cavity. The burner panel can further include a cooling system disposed at least partially within the cooling cavity, the cooling system including a cooling fluid piping system in fluid communication with a cooling fluid inlet and one or more discharge openings comprising a slotted extension protruding from the cooling fluid piping system and defining a slot-shaped tube in fluid communication with the cooling fluid piping system, the one or more discharge openings configured to discharge a cooling fluid on at least a portion of the inner surface of the outer enclosure.
    Type: Application
    Filed: April 1, 2025
    Publication date: November 27, 2025
    Inventors: Martin Leber, Ryan Boardman, Ashish Kotwal, Connor Kirk
  • Systems and methods for cooling in a furnace
    Patent number: 12298079
    Abstract: The disclosed technology includes a burner panel including an outer enclosure having an outer surface and an inner surface and a burner enclosure disposed at least partially within the outer enclosure and having an outer surface and an inner surface, wherein the outer surface of the burner enclosure and the inner surface of the outer enclosure define a cooling cavity. The burner panel can further include a cooling system disposed at least partially within the cooling cavity, the cooling system including a cooling fluid piping system in fluid communication with a cooling fluid inlet and one or more discharge openings comprising a slotted extension protruding from the cooling fluid piping system and defining a slot-shaped tube in fluid communication with the cooling fluid piping system, the one or more discharge openings configured to discharge a cooling fluid on at least a portion of the inner surface of the outer enclosure.
    Type: Grant
    Filed: October 21, 2024
    Date of Patent: May 13, 2025
    Assignee: Inteco PTI, LLC
    Inventors: Martin Leber, Ryan Boardman, Ashish Kotwal, Connor Kirk