Patents by Inventor Ryan C. Lee

Ryan C. Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated passive cap in a system-in-package
    Publication number: 20080217708
    Abstract: According to an exemplary embodiment, a system-in-package includes at least one semiconductor die situated over a package substrate. The system-in-package further includes a wall structure situated on the at least one semiconductor die. The system-in-package further includes an integrated passive cap situated over the wall structure, where the integrated passive cap includes at least one passive component. The wall structure and the integrated passive cap form an air cavity over the at least one semiconductor die. The system-in-package can further include at least one bond pad situated on a cap substrate. The at least one bond pad on the cap substrate of the integrated passive cap can be electrically connected to a substrate bond pad on the package substrate.
    Type: Application
    Filed: January 8, 2008
    Publication date: September 11, 2008
    Applicant: SKYWORKS SOLUTIONS, INC.
    Inventors: Russ Reisner, Steve X. Liang, Sandra L. Petty-Weeks, Howard Chen, Ryan C. Lee