Abstract: A heat sink apparatus that utilizes a pivot couple and support with anchor-spring mounts to enable exertion of a uniform amount of force over the mounting surface of the apparatus that is thermally/physically coupled to a heat load. The apparatus can include a heat sink base that has a bottom side defining the mounting surface, and a top side to which a support is pivotally coupled by a pivot couple. The apparatus can include a first and second anchor that each have a first end connected to an anchor point and a second end coupled to a load surface on the support by a spring. The load surfaces can be symmetrically disposed on opposite sides of the pivot couple, which is centrally located relative to the mounting surface so that the force imparted by spring loads of the springs is evenly distributed over the mounting surface.

Abstract: A heat sink apparatus that utilizes a pivot couple and support with anchor-spring mounts to enable exertion of a uniform amount of force over the mounting surface of the apparatus that is thermally/physically coupled to a heat load. The apparatus can include a heat sink base that has a bottom side defining the mounting surface, and a top side to which a support is pivotally coupled by a pivot couple. The apparatus can include a first and second anchor that each have a first end connected to an anchor point and a second end coupled to a load surface on the support by a spring. The load surfaces can be symmetrically disposed on opposite sides of the pivot couple, which is centrally located relative to the mounting surface so that the force imparted by spring loads of the springs is evenly distributed over the mounting surface.

Abstract: A heat sink apparatus that utilizes a pivot couple and support with anchor-spring mounts to enable exertion of a uniform amount of force over the mounting surface of the apparatus that is thermally/physically coupled to a heat load. The apparatus can include a heat sink base that has a bottom side defining the mounting surface, and a top side to which a support is pivotally coupled by a pivot couple. The apparatus can include a first and second anchor that each have a first end connected to an anchor point and a second end coupled to a load surface on the support by a spring. The load surfaces can be symmetrically disposed on opposite sides of the pivot couple, which is centrally located relative to the mounting surface so that the force imparted by spring loads of the springs is evenly distributed over the mounting surface.

Abstract: A cover for an electronic device includes back cover, such as a tray, to receive the electronic device. The cover may also include a foldable flap that is foldable into a stand to support an electronic device held by the cover at one or more viewing angles oblique to a surface on which the cover is placed. The back cover and/or the foldable flap may include one or more activation mechanisms that, when moved relative to the electronic device, activate one or more functions of the electronic device (e.g., camera functions, display of information, etc.).

Abstract: A cover for an electronic device includes back cover, such as a tray, to receive the electronic device. The cover may also include a foldable flap that is foldable into a stand to support an electronic device held by the cover at one or more viewing angles oblique to a surface on which the cover is placed. The back cover and/or the foldable flap may include one or more activation mechanisms that, when moved relative to the electronic device, activate one or more functions of the electronic device (e.g., camera functions, display of information, etc.).

Abstract: A cover for an electronic device includes back cover, such as a tray, to receive the electronic device. The cover may also include a foldable flap that is foldable into a stand to support an electronic device held by the cover at one or more viewing angles oblique to a surface on which the cover is placed. The back cover and/or the foldable flap may include one or more activation mechanisms that, when moved relative to the electronic device, activate one or more functions of the electronic device (e.g., camera functions, display of information, etc.).

Abstract: Apparatus and methods for mounting of a processor coupled to a circuit board include use of a frame disposed around the processor. The frame decreases flexibility of the circuit board around the processor. Further, the frame may act as a mechanical stop limiting tilting of a heat sink coupled to the processor.

Abstract: A system and method are provided including a first thermal component adapted for thermal communication with an integrated circuit, and a second thermal component adapted for thermal communication with the first thermal component upon engagement therewith. Further provided is a coupler slidably coupled to the first thermal component and/or the second thermal component. In use, such coupler is capable of a first orientation for disengaging, the first thermal component and the second thermal component, and a second orientation for engaging the first thermal component and the second thermal component.

Abstract: Disclosed is an attachment apparatus. The attachment apparatus may facilitate attachment of various components to a printed circuit board (PCB) including a thermal management component.

Abstract: Apparatus and methods for mounting of a cooling device coupled to a circuit board include use of a clip that is rotated to mate with and engage the cooling device. Rotation of the clip occurs during installation of the cooling device and slides slots in the clip into interconnection with respective protrusions of the cooling device extending through the circuit board to where the clip is disposed. In an assembled configuration, the clip biases the cooling device to a processing unit coupled to the circuit board on an opposite side from the clip.