Abstract: A lighting assembly for a luminaire includes a circuit board and light sources arranged on the circuit board. A heat sink is coupled to the circuit board. A solid integrated optical array is coupled to the circuit board. The solid integrated optical array includes solid optical lenses. Each solid optical lens is disposed over a corresponding one of the light sources. Each solid optical lens includes a light guiding body defining a total internal reflection lens and an outer light directing surface. Each solid optical lens is adapted to pass a light beam in a predefined direction to form a beam pattern. Each solid optical lens is configured to maintain a base beam size of light passing therethrough, where the base beam size is less than eleven degrees. A bezel is disposed adjacent to the at least one solid integrated optical array and coupled to the heat sink.

Abstract: A lighting assembly for a luminaire includes a circuit board and light sources arranged on the circuit board. A heat sink is coupled to the circuit board. A solid integrated optical array is coupled to the circuit board. The solid integrated optical array includes solid optical lenses. Each solid optical lens is disposed over a corresponding one of the light sources. Each solid optical lens includes a light guiding body defining a total internal reflection lens and an outer light directing surface. Each solid optical lens is adapted to pass a light beam in a predefined direction to form a beam pattern. Each solid optical lens is configured to maintain a base beam size of light passing therethrough, where the base beam size is less than eleven degrees. A bezel is disposed adjacent to the at least one solid integrated optical array and coupled to the heat sink.

Abstract: In one embodiment, a light guide includes an emitter and a light guide body optically coupled to the emitter. The light guide body may define a cylindrical body that tapers along an angled plane from a top end towards a bottom end. The bottom end may define a light entrance to the light guide body.

Abstract: In one embodiment, an oral irrigator includes a reservoir, a base configured to support the reservoir, and a button assembly coupled to the base. The button assembly may include a button, a spring coupled to the button, and a seal coupled to the spring. The button may be movable between an original position and an actuation position. The spring may be configured to deform in response to a user input force moving the button from the original position to the actuation position, and to resiliently return the button to the original position in response to cessation of the user input force on the button. The seal may inhibit fluid from entering through the spring into the base.

Abstract: A flapper valve comprising a generally rigid flap which is mounted within a flexible body coating. The hinge in the flexible body is formed by using an internal reinforcement material having a permeated structure which allows for the body material to penetrate through the reinforcement material during the valve formation. This provides for a more sturdy hinge which better resists wear.

Abstract: In one embodiment, an oral irrigator includes a reservoir, a base configured to support the reservoir, and a button assembly coupled to the base. The button assembly may include a button, a spring coupled to the button, and a seal coupled to the spring. The button may be movable between an original position and an actuation position. The spring may be configured to deform in response to a user input force moving the button from the original position to the actuation position, and to resiliently return the button to the original position in response to cessation of the user input force on the button. The seal may inhibit fluid from entering through the spring into the base.

Abstract: Embodiments of substrates, semiconductor devices and methods are shown that include elongated structures to improve conduction. Elongated structures and methods are also shown that provide electromagnetic isolation to reduce noise in adjacent components.

Abstract: Systems and methods of providing illumination may be provided in accordance with the invention. A lighting unit may be provided comprising a plurality of light sources, each light source of said plurality being at least partially surrounded by an optical element, and a support configured to support the light source above a surface. The light sources may be light emitting plasma sources, and the support may be a high-mast support. In some embodiments, the optical element may be a reflector containing one or more facets, directing the light toward the surface. In some configurations, each light source of said plurality may be independently controllable and/or dimmable. A lighting unit may communicate with an external controller, which may provide instructions for controlling the light sources. A lighting system may be provided with a host controlling a plurality of lighting units, which may be organized into zones. The zones, lighting units, and/or light sources may be independently controllable.

Abstract: Systems and methods of providing illumination may be provided in accordance with the invention. A lighting unit may be provided comprising a plurality of light sources, each light source of said plurality being at least partially surrounded by an optical element, and a support configured to support the light source above a surface. The light sources may be light emitting plasma sources, and the support may be a high-mast support. In some embodiments, the optical element may be a reflector containing one or more facets, directing the light toward the surface. In some configurations, each light source of said plurality may be independently controllable and/or dimmable. A lighting unit may communicate with an external controller, which may provide instructions for controlling the light sources. A lighting system may be provided with a host controlling a plurality of lighting units, which may be organized into zones. The zones, lighting units, and/or light sources may be independently controllable.

Abstract: A method and device includes a first conductor formed on a first dielectric layer as a partial turn of a coil. A second conductor is formed on a second dielectric layer that covers the first dielectric layer and first conductor, the second conductor forming a partial turn of the coil. A vertical interconnect couples the first and second conductors to form a first full turn of the coil. The interconnect coupling can be enhanced by embedding some selective magnetic materials into the substrate.

Abstract: Embodiments of substrates, semiconductor devices and methods are shown that include elongated structures to improve conduction. Elongated structures and methods are also shown that provide electromagnetic isolation to reduce noise in adjacent components.

Abstract: Embodiments of substrates, semiconductor devices and methods are shown that include elongated structures to improve conduction. Elongated structures and methods are also shown that provide electromagnetic isolation to reduce noise in adjacent components.

Abstract: Systems and methods of providing illumination may be provided in accordance with the invention. A lighting unit may be provided comprising a plurality of light sources, each light source of said plurality being at least partially surrounded by an optical element, and a support configured to support the light source above a surface. The light sources may be light emitting plasma sources, and the support may be a high-mast support. In some embodiments, the optical element may be a reflector containing one or more facets, directing the light toward the surface. In some configurations, each light source of said plurality may be independently controllable and/or dimmable. A lighting unit may communicate with an external controller, which may provide instructions for controlling the light sources. A lighting system may be provided with a host controlling a plurality of lighting units, which may be organized into zones. The zones, lighting units, and/or light sources may be independently controllable.

Abstract: Systems and methods of providing illumination may be provided in accordance with the invention. A lighting unit may be provided comprising a plurality of light sources, each light source of said plurality being at least partially surrounded by an optical element, and a support configured to support the light source above a surface. The light sources may be light emitting plasma sources, and the support may be a high-mast support. In some embodiments, the optical element may be a reflector containing one or more facets, directing the light toward the surface. In some configurations, each light source of said plurality may be independently controllable and/or dimmable. A lighting unit may communicate with an external controller, which may provide instructions for controlling the light sources. A lighting system may be provided with a host controlling a plurality of lighting units, which may be organized into zones. The zones, lighting units, and/or light sources may be independently controllable.

Abstract: Some embodiments relate to an electronic package. The electronic package includes a substrate that includes a plurality of buildup layers. A first die is embedded in one of the buildup layers on one side of the substrate. A second die is bonded to the substrate within a cavity on an opposing side of the substrate. The first die and the second die may be electrically connected to conductors within the plurality of buildup layers. Other embodiments relate to method of connecting a first die to a second die to form an electronic package. The method includes attaching a first die to a core and fabricating a substrate onto the core. The method further includes creating a cavity in another of the buildup layers on an opposing side of the substrate and attaching a second die to the substrate within the cavity.

Abstract: Systems and methods of providing illumination may be provided in accordance with the invention. A lighting unit may be provided comprising a plurality of light sources, each light source of said plurality being at least partially surrounded by an optical element, and a support configured to support the light source above a surface. The light sources may be light emitting plasma sources, and the support may be a high-mast support. In some embodiments, the optical element may be a reflector containing one or more facets, directing the light toward the surface. In some configurations, each light source of said plurality may be independently controllable and/or dimmable. A lighting unit may communicate with an external controller, which may provide instructions for controlling the light sources. A lighting system may be provided with a host controlling a plurality of lighting units, which may be organized into zones. The zones, lighting units, and/or light sources may be independently controllable.

Abstract: Embodiments of substrates, semiconductor devices and methods are shown that include elongated structures to improve conduction. Elongated structures and methods are also shown that provide electromagnetic isolation to reduce noise in adjacent components.

Abstract: Embodiments of substrates, semiconductor devices and methods are shown that include elongated structures to improve conduction. Elongated structures and methods are also shown that provide electromagnetic isolation to reduce noise in adjacent components.

Abstract: Some embodiments relate to an electronic package. The electronic package includes a substrate that includes a plurality of buildup layers. A first die is embedded in one of the buildup layers on one side of the substrate. A second die is bonded to the substrate within a cavity on an opposing side of the substrate. The first die and the second die may be electrically connected to conductors within the plurality of buildup layers. Other embodiments relate to method of connecting a first die to a second die to form an electronic package. The method includes attaching a first die to a core and fabricating a substrate onto the core. The method further includes creating a cavity in another of the buildup layers on an opposing side of the substrate and attaching a second die to the substrate within the cavity.