Patents by Inventor Ryan F. Conroy
Ryan F. Conroy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11751354Abstract: A computing equipment box assembly can include a chassis base and a tray. The chassis base can include a bottom panel, an opening through the bottom panel, and a rim defined around the opening. The tray can include a body configured for supporting computing components, a frame section of the body sized to be supported atop the rim of the chassis base; and a downwardly embossed portion of the body extending downwardly from the rim and sized to fit within the opening of the chassis base when the frame section is supported atop the rim of the chassis base.Type: GrantFiled: June 25, 2021Date of Patent: September 5, 2023Assignee: Amazon Technologies, Inc.Inventors: Noah Thomas Kelly, Ryan F. Conroy, Christopher Mario Gil, Ali Elashri, Munish Sharma
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Patent number: 11716827Abstract: A computing equipment box assembly can include a mechanical chassis component, which can include a support sheet configured for supporting computing components. A plurality of passages can be formed through the support sheet. A mechanical cable can be routable down through at least one of the passages and up through at least one other of the passages. A tensioner can be couplable with the cable and adjustable to modify an amount of tension in the cable so as to alter an amount of pre-bow or pre-bend present in the mechanical chassis component. For example, the mechanical cable may be tensioned to apply a force to the support sheet and counteract an upward pre-bend or pre-bow so that the computing components are prevented from protruding into an adjacent upper volume for an upper computer server overhead and from sagging into an adjacent lower volume for a lower computer server underneath.Type: GrantFiled: September 28, 2021Date of Patent: August 1, 2023Assignee: Amazon Technologies, Inc.Inventors: Ryan F Conroy, Christopher Mario Gil
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Publication number: 20230066170Abstract: A device includes an interposer card that includes a processor, such as a system on a chip (SoC), and memory devices. The interposer card mounts to a mass storage device and has a shape that corresponds to a size of an end of the mass storage device to which the interposer card is mounted. The SoC of the interposer card is configured to implement an individual server for the mass storage device to which the interposer card is mounted. In some embodiments, a data storage system includes multiple mass storage devices mounted in a chassis and coupled to one or more backplanes, wherein interposer cards are connected between the mass storage devices and the one or more backplanes.Type: ApplicationFiled: October 7, 2022Publication date: March 2, 2023Applicant: Amazon Technologies, Inc.Inventors: Roey Rivnay, Brendan Cully, William Mark Megarity, Ryan F. Conroy, Andrew Kent Warfield, Priti Choudhary
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Patent number: 11553627Abstract: A sensor may detect a coolant leak at or near an appliance that is slidable between a seated position and an ejected position relative to a rack. In the seated position, a coolant supply line may be coupled with a conduit of the appliance to convey coolant past the appliance. A biaser can bias the appliance toward the ejected position, and a latch may secure the appliance in a seated position against the biaser. A releaser can release the latch in response to coolant leak detection by the sensor and permit the biaser to move the appliance toward the ejected position, for example, which may cause the conduit to become disconnected from the coolant supply line to cut off flow to the leak.Type: GrantFiled: March 25, 2019Date of Patent: January 10, 2023Assignee: Amazon Technologies, Inc.Inventors: Luke Thomas Gregory, Ryan F. Conroy, Felipe Enrique Ortega Gutierrez
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Patent number: 11467636Abstract: A device includes an interposer card that includes a processor, such as a system on a chip (SoC), and memory devices. The interposer card mounts to a mass storage device and has a shape that corresponds to a size of an end of the mass storage device to which the interposer card is mounted. The SoC of the interposer card is configured to implement an individual server for the mass storage device to which the interposer card is mounted. In some embodiments, a data storage system includes multiple mass storage devices mounted in a chassis and coupled to one or more backplanes, wherein interposer cards are connected between the mass storage devices and the one or more backplanes.Type: GrantFiled: September 29, 2020Date of Patent: October 11, 2022Assignee: Amazon Technologies, Inc.Inventors: Roey Rivnay, Brendan Cully, William Mark Megarity, Ryan F Conroy, Andrew Kent Warfield, Priti Choudhary
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Patent number: 10863652Abstract: A self-installing connector for a liquid cooling system of a datacenter component rack system. A datacenter component rack may include manifolds for conveying coolant to or from one or more datacenter electronic components for liquid cooling components of the datacenter electronic component. The self-installing connector provides a fluid connection between the manifold and a liquid cooling system of a datacenter electronic component. The self-installing connector may puncture the manifold at the time the datacenter electronic component is installed. The self-installing connector may form an opening in the manifold and secure one end of the self-installing connector into the opening upon installation of the datacenter electronic component into the datacenter component rack. The self-installing connector can separate at a dripless quick-disconnect coupling for datacenter electronic component maintenance.Type: GrantFiled: June 17, 2020Date of Patent: December 8, 2020Assignee: Amazon Technologies, Inc.Inventors: Ryan F. Conroy, Felipe Enrique Ortega Gutierrez, Luke Thomas Gregory
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Patent number: 10750632Abstract: A datacenter component rack may be used to mount electronic components. The datacenter component rack may include support surfaces which are evenly spaced on each side of the component rack. The support surfaces may form uniform slots for receiving the electronic components. The electronic components may include flanges for mounting the electronic components in the uniform slots. The flanges may be on each side of the electronic component and engage the support surfaces in the datacenter component rack. The flanges may support the electronic component after they have engaged with the support surfaces.Type: GrantFiled: March 28, 2019Date of Patent: August 18, 2020Assignee: Amazon Technologies, Inc.Inventors: Ryan F. Conroy, Ryan Monaghan, Christopher Strickland Beall, Darin Frink
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Patent number: 10701838Abstract: A self-installing connector for a liquid cooling system of a datacenter component rack system. A datacenter component rack may include manifolds for conveying coolant to or from one or more datacenter electronic components for liquid cooling components of the datacenter electronic component. The self-installing connector provides a fluid connection between the manifold and a liquid cooling system of a datacenter electronic component. The self-installing connector may puncture the manifold at the time the datacenter electronic component is installed. The self-installing connector may form an opening in the manifold and secure one end of the self-installing connector into the opening upon installation of the datacenter electronic component into the datacenter component rack. The self-installing connector can separate at a dripless quick-disconnect coupling for datacenter electronic component maintenance.Type: GrantFiled: March 25, 2019Date of Patent: June 30, 2020Assignee: Amazon Technologies, Inc.Inventors: Ryan F. Conroy, Felipe Enrique Ortega Gutierrez, Luke Thomas Gregory