Abstract: Inceptor systems and control levers for aircraft are described that are substantially mass balanced to eliminate false sensor readings on the control levers due to the presence of external forces such as acceleration acting on the control levers. The lever can be mass balanced using existing components such as the motor and its structure to avoid the need for additional mass. By constricting movement of the motor, this can also avoid the need for additional volume that would otherwise be required for the counterbalancing elements to sweep with movement of the lever. A linkage can be used to restrict movement of the motor while reading forces that acts upon the lever.

Abstract: This disclosure relates to combination therapies comprising anti-Pseudomonas Psl and PcrV binding molecules and related compositions, for use in prevention and treatment of Pseudomonas infection.

Abstract: This disclosure relates to combination therapies comprising anti-Pseudomonas Psl and PcrV binding molecules and related compositions, for use in prevention and treatment of Pseudomonas infection.

Abstract: An electronic system is described that includes a headset device and associated cooling system. The headset device may be configured to physically separate high temperature components from other components of the headset device into multiple cavities. In some cases, the headset device may be divided into a display cavity and an electronics cavity to separate the display components from other components of the headset device.

Abstract: The present disclosure generally relates to antibodies, antigen binding fragments thereof, polypeptides, and immunoconjugates that bind to CD123 antigen (the ? chain of the interleukin-3 receptor) and deliver a payload to CD123 expressing cells. The payload is a topoisomerase inhibitor that efficiently kills CD123 expressing tumor cells while sparing hematopoietic stem cells and mature hematopoietic cells.

Abstract: A headset includes a thermal frame disposed within a housing. A printed circuit board (PCB) is thermally coupled to the thermal frame. Heat generated by one or more electrical components on the PCB is transmitted to the thermal frame, which distributes the heat uniformly throughout the headset. A first heat pipe is disposed on a first side of the PCB in contact with at least a portion of the thermal frame, the PCB, and/or an electrical component disposed on the PCB to draw heat from the electrical component, and a second heat pipe is disposed proximate a second side of the PCB and is configured to draw heat from second side of the PCB.

Abstract: A device includes a micro-organic light emitting diode (?-OLED) display panel and an electronic component. An electrical connector electrically couples the ?-OLED display panel and the electronic component. A standoff is disposed between the electronic component and the ?-OLED display panel. The standoff physically couples the electronic component and the ?-OLED display panel with a gap therebetween. The gap thermally decouples the electronic component from the ?-OLED display panel. A U-shaped heat sink can be disposed in the standoff, and heat generated by the ?-OLED display can be mitigated by a system fan when a U-shaped heat sink is disposed in the standoff.

Abstract: Rudder pedal and brake inceptor devices are described that utilize a straight-line mechanism and rotary joints to achieve straight line motion in a compact volume. The devices can include four or more bar linkages that translate forward motion of a pedal into a rotary motion of a common shaft, such that forward motion of one pedal causes the other pedal to retract while allowing for yaw motion control of the aircraft.

Abstract: The disclosed computer-implemented method may include detecting an amount of energy being discharged from a battery of a computing device. The method may further include predicting, based on the amount of energy being discharged from the battery, a thermal response of the computing device. Furthermore, the method may include performing thermal management of the computing device based on the predicted thermal response. Various other methods, systems, and computer-readable media are also disclosed.

Abstract: Rudder pedal and brake inceptor devices are described that utilize a straight-line mechanism and rotary joints to achieve straight line motion in a compact volume. The devices can include four or more bar linkages that translate forward motion of a pedal into a rotary motion of a common shaft, such that forward motion of one pedal causes the other pedal to retract while allowing for yaw motion control of the aircraft.

Abstract: A headset includes a thermal frame disposed within a housing. A printed circuit board (PCB) is thermally coupled to the thermal frame. Heat generated by one or more electrical components on the PCB is transmitted to the thermal frame, which distributes the heat uniformly throughout the headset. A first heat pipe is disposed on a first side of the PCB in contact with at least a portion of the thermal frame, the PCB, and/or an electrical component disposed on the PCB to draw heat from the electrical component, and a second heat pipe is disposed proximate a second side of the PCB and is configured to draw heat from second side of the PCB.

Abstract: A polymer laminate includes a plurality of ultra-high molecular weight polyethylene thin films, where each polyethylene thin film has an in-plane thermal conductivity of at least approximately 5 W/mK and an in-plane elastic modulus of at least approximately 20 GPa. The polymer laminate may be incorporated into an eyewear device and may be configured to disperse heat during operation thereof in a manner effective to improve the functionality and/or wearability of the device.

Abstract: A headset includes a thermal frame disposed within a housing. A printed circuit board (PCB) is thermally coupled to the thermal frame. Heat generated by one or more electrical components on the PCB is transmitted to the thermal frame, which distributes the heat uniformly throughout the headset. A first heat pipe is disposed on a first side of the PCB in contact with at least a portion of the thermal frame, the PCB, and/or an electrical component disposed on the PCB to draw heat from the electrical component, and a second heat pipe is disposed proximate a second side of the PCB and is configured to draw heat from second side of the PCB.

Abstract: A device includes a micro-organic light emitting diode (µ-OLED) display panel and an electronic component. An electrical connector electrically couples the µ-OLED display panel and the electronic component. An air duct is physically coupled to the µ-OLED display panel and the electronic component. The air duct functions to cool the µ-OLED display panel when air flows through the air duct. A system fan provides air flow to the air duct and dissipates heat away from the display panel. A system fan can be located disconnected from the µ-OLED display panel and can provide air flow to the air duct to dissipate heat away from the display panel. The device can be implemented with a single fan solution or a multiple fan solution (e.g., two or more fans).

Abstract: A device includes a micro-organic light emitting diode (µ-OLED) display panel and an electronic component. An electrical connector electrically couples the µ-OLED display panel and the electronic component. A standoff is disposed between the electronic component and the µ-OLED display panel. The standoff physically couples the electronic component and the µ-OLED display panel with a gap therebetween. The gap thermally decouples the electronic component from the µ-OLED display panel. A fan that is integrated with the µ-OLED display panel is placed in the standoff and actively cools the display panel. When the fan provides air flow over the µ-OLED display panel, heat generated by the µ-OLED display is mitigated by cooling air.

Abstract: A device includes a micro-organic light emitting diode (?-OLED) display panel and an electronic component. An electrical connector electrically couples the ?-OLED display panel and the electronic component. A standoff is disposed between the electronic component and the ?-OLED display panel. The standoff physically couples the electronic component and the ?-OLED display panel with a gap therebetween. The gap thermally decouples the electronic component from the ?-OLED display panel. A U-shaped heat sink can be disposed in the standoff, and heat generated by the ?-OLED display can be mitigated by a system fan when a U-shaped heat sink is disposed in the standoff.

Abstract: A headset includes a thermal frame disposed within a housing. A printed circuit board (PCB) is thermally coupled to the thermal frame. Heat generated by one or more electrical components on the PCB is transmitted to the thermal frame, which distributes the heat uniformly throughout the headset. A first heat pipe is disposed on a first side of the PCB in contact with at least a portion of the thermal frame, the PCB, and/or an electrical component disposed on the PCB to draw heat from the electrical component, and a second heat pipe is disposed proximate a second side of the PCB and is configured to draw heat from second side of the PCB.

Abstract: The present invention relates to bispecific antibodies having activity against a vascular endothelial growth factor (VEGF) and an angiopoietin (ANG), and methods of making and using such bispecific antibodies.