Patents by Inventor Ryan Freeman

Ryan Freeman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240070795
    Abstract: The disclosed embodiments relate generally to complex data stream control and entitlement. Specifically, the disclosed embodiments provide systems and methods for ensuring that only authenticated/verified participants receive data streams. A third party, e.g., a party other than the data provider or the data recipient, who is nevertheless associated with both the data provider and the data recipient, may be involved in controlling whether data streams from the data provider can reach the data recipient. Thus, a third party may logically sit between the data provider and the data recipient, and may decide whether the data recipient should receive data streams. The disclosed embodiments implement data generation, flow, control and permissioning between multiple entities via digital assets accessed and manipulated on a shared data structure.
    Type: Application
    Filed: October 19, 2023
    Publication date: February 29, 2024
    Applicant: Chicago Mercantile Exchange Inc.
    Inventors: Ryan Pierce, Elizabeth Freeman, Angela Wozniak, Mansoor Ahmed
  • Patent number: 11848349
    Abstract: A method of forming a curved semiconductor includes: forming a device layer on a semiconductor substrate; forming a metal layer on the device layer; removing the semiconductor substrate from the device layer; and curving the device layer and the metal layer.
    Type: Grant
    Filed: April 19, 2019
    Date of Patent: December 19, 2023
    Assignee: HRL LABORATORIES, LLC
    Inventors: Andrew C. Keefe, Geoffrey P. McKnight, Alexander R. Gurga, Ryan Freeman
  • Patent number: 10998372
    Abstract: A method of manufacturing a hybrid focal-plane array includes: forming a read-out integrated circuit with integral bending slit; forming a detector die separately from the read-out integrated circuit and including a detector with integral bending slit; and joining the read-out integrated circuit and the detector die to each other such that the read-out bending slit and the detector bending slit are aligned with each other.
    Type: Grant
    Filed: April 18, 2019
    Date of Patent: May 4, 2021
    Assignee: HRL Laboratories, LLC
    Inventors: Geoffrey P. McKnight, Andrew C. Keefe, Alexander R. Gurga, Ryan Freeman
  • Patent number: 10861060
    Abstract: Systems, methods, and computer-readable media are disclosed for dynamically determining personalized promotional offers using markers. In one embodiment, an example method may include determining a first user history associated with a first user account and a second user history associated with a second user account, the first user history and the second user history being indicative of respective interactions by a first user and a second user with a marketplace, receiving an indication of interaction by the first user with a marker associated with a promotional offer campaign, determining, using the first user history, a first promotional offer for the first user, associating the first promotional offer with the first user account, receiving an indication of interaction by the second user with the marker, determining, using the second user history, a second promotional offer for the second user, and associating the second promotional offer with the second user account.
    Type: Grant
    Filed: August 8, 2018
    Date of Patent: December 8, 2020
    Assignee: Amazon Technologies, Inc.
    Inventors: Joseph Charles Brust, Shayne Ashlyn Smith, Joel Ryan Freeman, Michael Bell Trueman, Yury Lizunov, Jason Adrian Galep
  • Patent number: 10748957
    Abstract: A method of manufacturing a curved semiconductor die includes: designing a semiconductor die design by conducting finite element analysis of an initial semiconductor die design having a partial spherical curvature, the initial semiconductor die design including a shape of a semiconductor die and a location and shape of a slit in the semiconductor die; when a size of a gap at the slit in the curved semiconductor die is outside a tolerance, modifying the initial semiconductor die design to provide a revised semiconductor die design and conducting another finite element analysis thereof; when the size of the gap at the slit in the curved semiconductor die is within the tolerance, manufacturing a microfabrication mask utilizing the initial semiconductor die design or the revised semiconductor die design having the size of the gap within the tolerance; forming a semiconductor die by utilizing the microfabrication mask; and curving the semiconductor die.
    Type: Grant
    Filed: April 18, 2019
    Date of Patent: August 18, 2020
    Assignee: HRL Laboratories, LLC
    Inventors: Geoffrey P. McKnight, Andrew C. Keefe, Alexander R. Gurga, Ryan Freeman
  • Publication number: 20170065063
    Abstract: A collapsible device stand with a large folding arm and a variable position spring loaded sliding rail carrier with a small folding arm. Primarily used for holding an object at an angle or vertically. This device can hold a mobile device, tablet, or cell phone from below or from the side. The sliding rail carrier locks into place by upwards force using friction between the rail carrier and main body track produced by one or more sliding rail carrier springs. This stand collapses completely into the main housing when both arms are folded down and the sliding rail arm is slipped into a cavity in the fixed position folding arm. The main housing cap includes a keychain hole. An optional configuration includes a tripod mounting socket used to mount this device to a tripod.
    Type: Application
    Filed: September 8, 2015
    Publication date: March 9, 2017
    Inventor: Robert Ryan Freeman