Patents by Inventor Ryan Garrison
Ryan Garrison has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20230217907Abstract: Disclosed are livewell systems and methods of operating livewell systems. A livewell system may include a livewell tank having a chamber formed therein, a fill sensor configured to detect a fill level of the chamber, an intake pump configured to selectively convey water into the chamber, and a control unit including a processor and a memory storing instructions. The processor may be configured to execute the instructions to receive a fill signal, determine whether the chamber is filled to a predetermined fill level; and in response to the fill signal and a determination that the chamber is not filled to the predetermined fill level, cause the intake pump to convey water into the chamber.Type: ApplicationFiled: February 27, 2023Publication date: July 13, 2023Applicant: iKon Boats, LLCInventors: Matthew OSTMEYER, Mike MYERS, Brent Brenon BUTLER, Joel CHAPLIN, Ryan GARRISON, Cameron O'CONNELL, Edgar MILLER, Andrew CLEMENTS, Tommy CONNER
-
Publication number: 20230180723Abstract: Disclosed are livewell systems and methods of operating livewell systems. A livewell system may include a livewell tank having a chamber formed therein, a fill sensor configured to detect a fill level of the chamber, an intake pump configured to selectively convey water into the chamber, and a control unit including a processor and a memory storing instructions. The processor may be configured to execute the instructions to receive a fill signal, determine whether the chamber is filled to a predetermined fill level; and in response to the fill signal and a determination that the chamber is not filled to the predetermined fill level, cause the intake pump to convey water into the chamber.Type: ApplicationFiled: December 8, 2022Publication date: June 15, 2023Applicant: iKon Boats, LLCInventors: Matthew OSTMEYER, Mike MYERS, Brent Brenon BUTLER, Joel CHAPLIN, Ryan GARRISON, Cameron O'CONNELL, Edgar MILLER, Andrew CLEMENTS, Tommy CONNER
-
Patent number: 10062597Abstract: A chuck for testing an integrated circuit includes an upper conductive layer having a lower surface and an upper surface suitable to support a device under test. An upper insulating layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper conductive layer, and a lower surface. A middle conductive layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper insulating layer, and a lower surface.Type: GrantFiled: August 7, 2017Date of Patent: August 28, 2018Assignee: FormFactor Beaverton, Inc.Inventors: Michael E. Simmons, Kazuki Negishi, Ryan Garrison, Philip Wolf
-
Patent number: 9991152Abstract: Wafer-handling end effectors and semiconductor manufacturing devices that include and/or are utilized with wafer-handling end effectors are disclosed herein. The end effectors include an end effector body and a plurality of wafer-contacting surfaces that is supported by the end effector body and configured to form an at least partially face-to-face contact with a wafer. The end effectors further include a vacuum distribution manifold that extends between a robot-proximal end of the end effector body and the plurality of wafer-contacting surfaces. The end effectors also include a plurality of vacuum openings that is defined within the plurality of wafer-contacting surfaces and extends between the plurality of wafer-contacting surfaces and the vacuum distribution manifold. The end effectors further include a plurality of sealing structures each of which is associated with a respective one of the plurality of wafer-contacting surfaces.Type: GrantFiled: February 25, 2015Date of Patent: June 5, 2018Assignee: Cascade Microtech, Inc.Inventors: Robbie Ingram-Goble, Michael E. Simmons, Philip Wolf, Ryan Garrison, Christopher Storm
-
Publication number: 20170338142Abstract: A chuck for testing an integrated circuit includes an upper conductive layer having a lower surface and an upper surface suitable to support a device under test. An upper insulating layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper conductive layer, and a lower surface. A middle conductive layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper insulating layer, and a lower surface.Type: ApplicationFiled: August 7, 2017Publication date: November 23, 2017Inventors: Michael E. Simmons, Kazuki Negishi, Ryan Garrison, Philip Wolf
-
Patent number: 9741599Abstract: A chuck for testing an integrated circuit includes an upper conductive layer having a lower surface and an upper surface suitable to support a device under test. An upper insulating layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper conductive layer, and a lower surface. A middle conductive layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper insulating layer, and a lower surface.Type: GrantFiled: March 16, 2016Date of Patent: August 22, 2017Assignee: Cascade Microtech, Inc.Inventors: Michael E. Simmons, Kazuki Negishi, Ryan Garrison, Philip Wolf
-
Patent number: 9506973Abstract: A chuck for testing an integrated circuit includes an upper conductive layer having a lower surface and an upper surface suitable to support a device under test. An upper insulating layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper conductive layer, and a lower surface. A middle conductive layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper insulating layer, and a lower surface.Type: GrantFiled: April 11, 2011Date of Patent: November 29, 2016Assignee: Cascade Microtech, Inc.Inventors: Michael E. Simmons, Kazuki Negishi, Roy Jensen, Ryan Garrison, Philip Wolf
-
Publication number: 20160195579Abstract: A chuck for testing an integrated circuit includes an upper conductive layer having a lower surface and an upper surface suitable to support a device under test. An upper insulating layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper conductive layer, and a lower surface. A middle conductive layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper insulating layer, and a lower surface.Type: ApplicationFiled: March 16, 2016Publication date: July 7, 2016Inventors: Michael E. Simmons, Kazuki Negishi, Ryan Garrison, Philip Wolf
-
Publication number: 20150255322Abstract: Wafer-handling end effectors and semiconductor manufacturing devices that include and/or are utilized with wafer-handling end effectors are disclosed herein. The end effectors include an end effector body and a plurality of wafer-contacting surfaces that is supported by the end effector body and configured to form an at least partially face-to-face contact with a wafer. The end effectors further include a vacuum distribution manifold that extends between a robot-proximal end of the end effector body and the plurality of wafer-contacting surfaces. The end effectors also include a plurality of vacuum openings that is defined within the plurality of wafer-contacting surfaces and extends between the plurality of wafer-contacting surfaces and the vacuum distribution manifold. The end effectors further include a plurality of sealing structures each of which is associated with a respective one of the plurality of wafer-contacting surfaces.Type: ApplicationFiled: February 25, 2015Publication date: September 10, 2015Inventors: Robbie Ingram-Goble, Michael E. Simmons, Philip Wolf, Ryan Garrison, Christopher Storm
-
Publication number: 20130075982Abstract: A chuck for testing an integrated circuit includes an upper conductive layer having a lower surface and an upper surface suitable to support a device under test. An upper insulating layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper conductive layer, and a lower surface. A middle conductive layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper insulating layer, and a lower surface.Type: ApplicationFiled: April 11, 2011Publication date: March 28, 2013Applicant: Cascade Microtech, IncInventors: Michael E. Simmons, Kazuki Negishi, Roy Jensen, Ryan Garrison, Philip Wolf