Patents by Inventor Ryan Holsapple

Ryan Holsapple has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Temperature Sensing Element for a Thermal Conductivity Detector
    Publication number: 20250012642
    Abstract: A thermal conductivity detector device includes a chamber defining an inlet channel and an outlet channel. A temperature sensing element is positioned proximal to the outlet channel to detect temperature of a fluid flowing through the chamber from the inlet channel to the outlet channel. The temperature sensing element includes a body defined in a cylindrical shape with a through passage and, the through passage defines an inner surface for the flow of a fluid.
    Type: Application
    Filed: September 16, 2024
    Publication date: January 9, 2025
    Applicant: ABB Schweiz AG
    Inventors: Subhashish Dasgupta, Max Bailey, Jason Lewis, Steve Hardy, Steve Lakey, John Hester, Ryan Holsapple
  • Device and a System for Detecting Thermal Conductivity of a Fluid
    Publication number: 20250003903
    Abstract: A thermal conductivity detector device includes a chamber defined with an inlet channel and an outlet channel. The chamber is of an elliptical shape having at least two opposing sides of the chamber defined in an arcuate shape. The chamber is defined in the shape of a venturi. A temperature sensing element is positioned within the chamber. The temperature sensing element is configured to determine the temperature of a fluid flowing through the chamber from the inlet channel towards the outlet channel.
    Type: Application
    Filed: September 16, 2024
    Publication date: January 2, 2025
    Applicant: ABB Schweiz AG
    Inventors: Subhashish Dasgupta, Michael May, Jason Lewis, Jason Aaron Lawrence, Steve Lakey, Steve Hardy, Max Bailey, Ryan Holsapple, John Hester