Abstract: Disclosed are the identification of multiple proteins that can bind to LILR receptors. based on which a screening system for LILR antagonist and blocking antibodies has been developed.

Abstract: Provided herein are methods and compositions for the identification of modulators of LILRB3 activation. Also provided herein are methods of treating cancer comprising the administration of an inhibitor LILRB3 activation. Also provided are methods of treating autoimmune disease or inhibiting the onset of transplant rejection or treating an inflammatory disorder comprising administering an agonist of LILRB3 activation to a subject.

Abstract: A composite semiconductor package is disclosed. The package includes a lead frame having first and second die bonding pads, the first and second die bonding pads having a large lateral separation therebetween, a first device bonded to the first die bonding pad, a second device bonded to the second die bonding pad, a plurality of first leads coupled to the first die bonding pad, a plurality of second leads coupled to the second die bonding pad, and an encapsulant covering the lead frame, the first and second devices and at least a portion of the first and second pluralities of leads. The package may be a TSSOP-8 composite package having a common drain MOSFET pair and an IC.

Abstract: Briefly, in accordance with one or more embodiments, a transimpedance amplifier of an optical transceiver or the like has a feedback element in a feedback arrangement and is capable of receiving an electrical current from an optical-to-electrical converter to generate an output voltage in response to the electrical current. A control circuit coupled to the feedback element is capable of providing a control signal to control a bias current of the transimpedance amplifier to maintain DC current flowing through the feedback element at or near zero by changing the bias current in response to the control circuit detecting a non-zero DC current flowing through the feedback element.

Abstract: A composite semiconductor package is disclosed. The package includes a lead frame having first and second die bonding pads, the first and second die bonding pads having a large lateral separation therebetween, a first device bonded to the first die bonding pad, a second device bonded to the second die bonding pad, a plurality of first leads coupled to the first die bonding pad, a plurality of second leads coupled to the second die bonding pad, and an encapsulant covering the lead frame, the first and second devices and at least a portion of the first and second pluralities of leads. The package may be a TSSOP-8 composite package having a common drain MOSFET pair and an IC.