Patents by Inventor Ryan J. Welch

Ryan J. Welch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hybrid electrical circuit method with mated substrate carrier method
    Patent number: 6971160
    Abstract: A hybrid integrated circuit fabrication method in which an insulating substrate member and its metallic substrate carrier are made to be mating with precision through use of computer controlled machining performed on each member. A combination of disclosed specifically tailored software and commercially available software are used in the method to generate code for controlling a precision milling machine during the fabrication of substrate and substrate carrier members. The method for precision mating of substrate and substrate carrier enable disposition of a precision recess in the substrate carrier and the location of recess pillars and pedestals (the latter being for integrated circuit die mounting use) at any carrier recess location desirable for electrical, thermal or physical strength reasons.
    Type: Grant
    Filed: January 3, 2002
    Date of Patent: December 6, 2005
    Assignee: The United States of America as represented by the Secretary of the Air Force
    Inventors: Ryan J. Welch, Tony K. Quach