Patents by Inventor Ryan Keith Maynard

Ryan Keith Maynard has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chemical mechanical polishing of dual orientation polycrystalline materials
    Patent number: 6899596
    Abstract: A chemical mechanical polishing (CMP) process using a chemically active slurry having a polarity selected to affect the relative oxidation rates of respective crystalline planes of a polycrystalline surface being polished. The slurry polarity is controlled to equilibrate the material removal rates from the respective crystalline planes during the CMP process. A polar solute may be added to a base solvent to achieve the desired polarity. A CMP process for a tungsten film may utilize a water-based slurry containing an abrasive agent, an oxidizing agent, and a solute having a polarity less than that of water. The abrasive agent may be colloidal silica, the oxidizing agent may be hydrogen peroxide, and the solute may be benzene.
    Type: Grant
    Filed: April 12, 2002
    Date of Patent: May 31, 2005
    Assignee: Agere Systems, Inc.
    Inventors: Michael Antonell, Jennifer A. Antonell, Erik Cho Houge, Ryan Keith Maynard, Darrell L. Simpson
  • Chemical mechanical polishing of dual orientation polycrystalline materials
    Publication number: 20030162481
    Abstract: A chemical mechanical polishing (CMP) process using a chemically active slurry having a polarity selected to affect the relative oxidation rates of respective crystalline planes of a polycrystalline surface being polished. The slurry polarity is controlled to equilibrate the material removal rates from the respective crystalline planes during the CMP process. A polar solute may be added to a base solvent to achieve the desired polarity. A CMP process for a tungsten film may utilize a water-based slurry containing an abrasive agent, an oxidizing agent, and a solute having a polarity less than that of water. The abrasive agent may be colloidal silica, the oxidizing agent may be hydrogen peroxide, and the solute may be benzene.
    Type: Application
    Filed: April 12, 2002
    Publication date: August 28, 2003
    Inventors: Michael Antonell, Jennifer A. Antonell, Erik Cho Houge, Ryan Keith Maynard, Darrell L. Simpson