Patents by Inventor Ryan Kimura

Ryan Kimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of assembling a peripheral device printed circuit board package
    Patent number: 6269537
    Abstract: A PCB package for shielding electromagnetic radiation from exiting or entering the package. In one embodiment the package includes first and second electrically conductive covers and first and second electrically conductive frames. The first frame electrically connected to the first cover and the second frame electrically connected to the second cover. The first frame is then electrically connected to the second frame. The first and second frames can be made of electrically conductive plastics or metals or any other electrically conductive materials. Methods of assembling the packages of the various embodiments are also set forth.
    Type: Grant
    Filed: July 28, 1999
    Date of Patent: August 7, 2001
    Assignee: Methode Electronics, Inc.
    Inventors: Ryan Kimura, James Farquhar, Jeffrey Allen, Michael Chao, Stephen Hatch, Scott Herbert, Brandt Weibezhan, Iggoni Fajardo