Abstract: Optoelectronic devices with heat spreader units are described. An optoelectronic device includes a back-contact optoelectronic cell including a plurality of back-contact metallization regions. One or more heat spreader units are disposed above the plurality of back-contact metallization regions. A heat sink is disposed above the one or more heat spreader units.

Abstract: Interconnects for optoelectronic devices are described. For example, an interconnect for an optoelectronic device includes an interconnect body having an inner surface, an outer surface, a first end, and a second end. A plurality of bond pads is coupled to the inner surface of the interconnect body, between the first and second ends. A stress relief feature is disposed in the interconnect body. The stress relief feature includes a slot disposed entirely within the interconnect body without extending through to the inner surface, without extending through to the outer surface, without extending through to the first end, and without extending through to the second end of the interconnect body.

Abstract: Interconnects for optoelectronic devices are described. An interconnect may include a stress relief feature. An interconnect may include an L-shaped feature.

Abstract: A solar concentrator assembly is disclosed. The solar concentrator assembly comprises a first reflective device having a first reflective front side and a first rear side, a second reflective device having a second reflective front side and a second rear side, the second reflective device positioned such that the first reflective front side faces the second rear side, and a support assembly coupled to and supporting the first and second reflective devices, the second reflective device positioned to be vertically offset from the first reflective device.

Abstract: In one embodiment, a heat sink comprising a folded fin is disclosed. The folded fin comprises a base portion, an offset portion extending away from the base portion, the offset portion having a width, a narrowing tapering portion having a maximum width equal to the width of the offset portion, and an extension portion extending away from the narrowing tapering portion, the extension portion having a width smaller than the width of the offset portion.

Abstract: Interconnects for optoelectronic devices are described. An interconnect may include a stress relief feature. An interconnect may include an L-shaped feature.

Abstract: A solar concentrator assembly is disclosed. The solar concentrator assembly comprises a first reflector facing in a first direction, a second reflector facing in a second direction, the second direction opposite the first direction, and a rotational member having a long axis transverse to the first and second directions, the rotational member disposed between and coupled to each of the first and second reflectors.

Abstract: A solar concentrator assembly is disclosed. The solar concentrator assembly comprises a first reflective device having a first reflective front side and a first rear side, a second reflective device having a second reflective front side and a second rear side, the second reflective device positioned such that the first reflective front side faces the second rear side, and a support assembly coupled to and supporting the first and second reflective devices, the second reflective device positioned to be vertically offset from the first reflective device.

Abstract: Arrangements of diodes and heat spreaders for solar modules are described. For example, a solar module may include a backsheet with a low profile, surface-mount diode disposed above the backsheet. A pair of ribbon interconnects is coupled to the low profile, surface-mount diode and may penetrate the backsheet.

Abstract: A solar module includes a solar cell, a heat spreader layer disposed above the solar cell, and a cell interconnect disposed above the solar cell. From a top-down perspective, the heat spreader layer at least partially surrounds an exposed portion of the cell interconnect.

Abstract: Methods and apparatuses to increase a speed of airflow through a heat exchanger are described. An optoelectronic device comprising a heat exchanger is coupled to an airflow accelerator. The airflow accelerator comprises a surface to guide the airflow towards the heat exchanger. An optical element is coupled to concentrate light onto the optoelectronic device. The size of the surface, position of the airflow accelerator relative to the heat exchanger, or both can determine increase in speed of the airflow. A photovoltaic (“PV”) system comprises rows of receivers; rows of optical elements to concentrate light onto the receivers, and rows of airflow accelerators coupled to the receivers to increase the speed of airflow through heat exchangers. The airflow can be deflected by an airflow accelerator towards a heat exchanger. A wind load can be reduced by the airflow accelerator.

Abstract: Optoelectronic devices with bypass diodes are described. An optoelectronic device includes a bypass diode, a heat spreader unit disposed above, and extending over, the bypass diode, and a heat sink disposed above the heat spreader unit. Another optoelectronic device includes a bypass diode, a heat spreader unit disposed above, but not extending over, the bypass diode, and a heat sink disposed above the heat spreader unit.

Abstract: Integrated circuit-chip hot spot temperatures are reduced by providing localized regions of higher thermal conductivity in the conductive material interface at pre-designed locations by controlling how particles in the thermal paste stack- or pile-up during the pressing or squeezing of excess material from the interface. Nested channels are used to efficiently decrease the thermal resistance in the interface, by both allowing for the thermally conductive material with a higher particle volumetric fill to be used and by creating localized regions of densely packed particles between two surfaces.

Abstract: Optoelectronic devices with heat spreader units are described. An optoelectronic device includes a back-contact optoelectronic cell including a plurality of back-contact metallization regions. One or more heat spreader units are disposed above the plurality of back-contact metallization regions. A heat sink is disposed above the one or more heat spreader units.

Abstract: Integrated circuit-chip hot spot temperatures are reduced by providing localized regions of higher thermal conductivity in the conductive material interface at pre-designed locations by controlling how particles in the thermal paste stack- or pile-up during the pressing or squeezing of excess material from the interface. Nested channels are used to efficiently decrease the thermal resistance in the interface, by both allowing for the thermally conductive material with a higher particle volumetric fill to be used and by creating localized regions of densely packed particles between two surfaces.

Abstract: A micro-electromechanical device or MEMS having a conformal layer of material deposited by atomic layer deposition is discussed. The layer may provide physical protection to moving components of the device, may insulate electrical components of the device, may present a biocompatible surface interface to a biological system, and may otherwise improve such devices. The layer may also comprise a combination of multiple materials each deposited with great control to allow creating layers of customizable properties and to allow creating layers having multiple independent functions, such as providing physical protection from wear and providing electrical insulation.

Abstract: Integrated circuit-chip hot spot temperatures are reduced by providing localized regions of higher thermal conductivity in the conductive material interface at pre-designed locations by controlling how particles in the thermal paste stack- or pile-up during the pressing or squeezing of excess material from the interface. Nested channels are used to efficiently decrease the thermal resistance in the interface, by both allowing for the thermally conductive material with a higher particle volumetric fill to be used and by creating localized regions of densely packed particles between two surfaces.

Abstract: A stress release thermal interface is provided for preventing the building up of stress between chip and heat sink surfaces in a multi-chip module (MCM) while maintaining reliable thermal and mechanical contact. The interface achieves enhanced thermal conduction by using flexible, interlocking posts attached to the surfaces of the chip and the heat sink.

Abstract: Integrated circuit-chip hot spot temperatures are reduced by providing localized regions of higher thermal conductivity in the conductive material interface at pre-designed locations by controlling how particles in the thermal paste stack- or pile-up during the pressing or squeezing of excess material from the interface. Nested channels are used to efficiently decrease the thermal resistance in the interface, by both allowing for the thermally conductive material with a higher particle volumetric fill to be used and by creating localized regions of densely packed particles between two surfaces.

Abstract: A cooling device has a large number of closely spaced impinging jets, adjacent an impingement gap, with parallel return paths for supplying coolant flow for the impinging jets with the least possible pressure drop using an interdigitated, branched hierarchical manifold. Surface enhancement features spanning the impingement gap form U-shaped microchannels between single impinging jets and single outlets.