Abstract: Techniques are provided for fabrication of an electronic device. A methodology implementing the techniques according to an embodiment includes forming a plurality of thin film components on a wafer substrate. The method also includes cutting one or more of the thin film components from the wafer substrate and extracting the one or more of the thin film components from the wafer substrate. The method further includes depositing the extracted thin film components onto pads of a printed circuit board (PCB) assembly. The method further includes performing a solder reflow to electrically couple the one or more thin film components onto the pads of the PCB assembly. The thin film component comprises a release layer, solder layers, solder barrier layers, non-wetting solder barrier layers, a passivation layer, and a component function layer. The component function layer may provide a resistive function, a capacitive function, a diode function, or a thermocouple function.

Abstract: In an example, a sensor platform includes at least one sensor configured to acquire sensor data about an environment in which the sensor platform is located, a wireless communication interface, and a computing platform. The computing platform can be configured to control the sensor platform to acquire first sensor data using the at least one sensor, acquire second sensor data, via the wireless communication interface, from at least one other sensor platform, and display, via a user interface, a fused sensor view that includes the first sensor data and includes or excludes the second sensor data based on a level of trust assigned to the at least one other sensor platform and a trust setting of the sensor platform.

Abstract: A storage, display and dispensing apparatus for tickets of various sizes that accounts for the tickets dispensed during a selected time period. The dispensing apparatus includes a bin housing for storing a pack of tickets, a ticket dispensing assembly through which the tickets are dispensed and includes a friction wheel assembly that is actuated as tickets passed through the tear bar assembly so that a count of such tickets is provided. A piezo electric sensing element is also employed to sense perforations between the tickets and to reset the friction wheel assembly count as a result thereof.