Patents by Inventor Ryan M. McCall

Ryan M. McCall has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9479854
    Abstract: A micro-electro-mechanical system (MEMS) microphone includes a rectangular substrate with a rigid base layer, a first metal layer, a second metal layer, one or more electrical pathways, an acoustic port, and a patterned flexible printed circuit board material. The MEMS microphone also includes a MEMS microphone die and a solid single-piece rectangular cover.
    Type: Grant
    Filed: June 30, 2015
    Date of Patent: October 25, 2016
    Assignee: Knowles Electronics, LLC
    Inventors: Peter V. Loeppert, Ryan M. McCall, Daniel Giesecke, Sandra F. Vos, John B. Szczech, Sung Bok Lee, Peter Van Kessel
  • Publication number: 20150304753
    Abstract: A micro-electro-mechanical system (MEMS) microphone includes a rectangular substrate with a rigid base layer, a first metal layer, a second metal layer, one or more electrical pathways, an acoustic port, and a patterned flexible printed circuit board material. The MEMS microphone also includes a MEMS microphone die and a solid single-piece rectangular cover.
    Type: Application
    Filed: June 30, 2015
    Publication date: October 22, 2015
    Inventors: Peter V. Loeppert, Ryan M. McCall, Daniel Giesecke, Sandra F. Vos, John B. Szczech, Sung Bok Lee, Peter Van Kessel
  • Patent number: 9078063
    Abstract: A microphone assembly includes a cover, a base coupled to the cover, a microelectromechanical system (MEMS) device disposed on the base. An opening is formed in the base and the MEMS device is disposed over the opening. The base includes a barrier that extends across the opening and is porous to sound. The remaining portions of the base do not extend across the opening.
    Type: Grant
    Filed: August 6, 2013
    Date of Patent: July 7, 2015
    Assignee: KNOWLES ELECTRONICS, LLC
    Inventors: Peter V. Loeppert, Ryan M. McCall, Daniel Giesecke, Sandra F. Vos, John B. Szczech, Sung Bok Lee, Peter Van Kessel
  • Publication number: 20140044297
    Abstract: A microphone assembly includes a cover, a base coupled to the cover, a microelectromechanical system (MEMS) device disposed on the base. An opening is formed in the base and the MEMS device is disposed over the opening. The base includes a barrier that extends across the opening and is porous to sound. The remaining portions of the base do not extend across the opening.
    Type: Application
    Filed: August 6, 2013
    Publication date: February 13, 2014
    Applicant: Knowles Electronics, LLC
    Inventors: Peter V. Loeppert, Ryan M. McCall, Daniel Giesecke, Sandra F. Vos, John B. Szczech, Sung Bok Lee, Peter Van Kessel