Patents by Inventor Ryan M. Trella

Ryan M. Trella has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11338480
    Abstract: A method including steps of (1) heating, with a heating system, an apparatus comprising an enclosure assembly and a temperature emulation assembly positioned within said enclosure assembly; (2) thermally isolating said temperature emulation assembly from said heating system with said enclosure assembly; (3) permitting conductive heat transfer to said temperature emulation assembly only through an enclosure assembly-leading end of said enclosure assembly; and (4) representing a hottest temperature and a coldest temperature of an article being emulated by said apparatus with said temperature emulation assembly.
    Type: Grant
    Filed: September 9, 2020
    Date of Patent: May 24, 2022
    Assignee: The Boeing Company
    Inventors: John M. Griffith, Steven M. Shewchuk, George E. Bible, Steven J. Plummer, Ryan M. Trella, Ronald J. Byington
  • Publication number: 20210039283
    Abstract: A method including steps of (1) heating, with a heating system, an apparatus comprising an enclosure assembly and a temperature emulation assembly positioned within said enclosure assembly; (2) thermally isolating said temperature emulation assembly from said heating system with said enclosure assembly; (3) permitting conductive heat transfer to said temperature emulation assembly only through an enclosure assembly-leading end of said enclosure assembly; and (4) representing a hottest temperature and a coldest temperature of an article being emulated by said apparatus with said temperature emulation assembly.
    Type: Application
    Filed: September 9, 2020
    Publication date: February 11, 2021
    Applicant: The Boeing Company
    Inventors: John M. Griffith, Steven M. Shewchuk, George E. Bible, Steven J. Plummer, Ryan M. Trella, Ronald J. Byington
  • Patent number: 10800072
    Abstract: An apparatus includes a enclosure assembly including an enclosure assembly-leading end and an opposed enclosure assembly-lagging end, and a temperature emulation assembly mounted within the enclosure assembly and including a temperature emulation assembly-leading end located proximate to the enclosure assembly-leading end and a temperature emulation assembly-lagging end spaced away from the enclosure assembly-lagging end. The enclosure assembly thermally isolates the temperature emulation assembly. The enclosure assembly permits conductive heat transfer to the temperature emulation assembly only through the enclosure assembly-leading end.
    Type: Grant
    Filed: April 24, 2017
    Date of Patent: October 13, 2020
    Assignee: The Boeing Company
    Inventors: John M. Griffith, George E. Bible, Steven M. Shewchuk, Steven J. Plummer, Ryan M. Trella, Ronald J. Byington
  • Publication number: 20180304501
    Abstract: An apparatus includes a enclosure assembly including an enclosure assembly-leading end and an opposed enclosure assembly-lagging end, and a temperature emulation assembly mounted within the enclosure assembly and including a temperature emulation assembly-leading end located proximate to the enclosure assembly-leading end and a temperature emulation assembly-lagging end spaced away from the enclosure assembly-lagging end. The enclosure assembly thermally isolates the temperature emulation assembly. The enclosure assembly permits conductive heat transfer to the temperature emulation assembly only through the enclosure assembly-leading end.
    Type: Application
    Filed: April 24, 2017
    Publication date: October 25, 2018
    Applicant: The Boeing Company
    Inventors: John M. Griffith, George E. Bible, Steven M. Shewchuk, Steven J. Plummer, Ryan M. Trella, Ronald J. Byington