Abstract: An electronic device may have a display. The display may include an array of pixels formed on a display panel. A system-in-package (SiP) may include a substrate, electronic components mounted on the substrate, and mold material that overlaps and conforms to the electronic components. A portion of the substrate that is not overlapped by the mold material may be bonded to the display panel. The electronic components mounted on the substrate of the SiP may include a timing controller integrated circuit and/or a display driver integrated circuit. A plurality of display driver integrated circuit chiplets may be mounted on the substrate of the SiP. The substrate of the SiP may be electrically connected to the display panel by side-wrapped conductive traces. The substrate of the SiP may have portions with different thicknesses.

Abstract: Improved redistribution layer structures for integrated circuit or system-on-chip (SoC) packages substrate are disclosed. Via landing pads and via interconnects in the redistribution layers are self-aligning with the centers of the vias aligning with the pads. This self-alignment may allow pads that terminate non-stacked vias to have decreased widths or diameters without extra capture space. The redistribution layers have vias with vertical or near vertical sidewalls. Vias may also have various shapes, widths, or lengths. Traces in the redistribution layers may have various lengths and shapes with lengths that may extend into layers routing the vias to provide increased metal density in the traces.

Abstract: Improved redistribution layer structures for integrated circuit or system-on-chip (SoC) packages substrate are disclosed. Via landing pads and via interconnects in the redistribution layers are self-aligning with the centers of the vias aligning with the pads. This self-alignment may allow pads that terminate non-stacked vias to have decreased widths or diameters without extra capture space. The redistribution layers have vias with vertical or near vertical sidewalls. Vias may also have various shapes, widths, or lengths. Traces in the redistribution layers may have various lengths and shapes with lengths that may extend into layers routing the vias to provide increased metal density in the traces.