Patents by Inventor Ryan Michael Avella

Ryan Michael Avella has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Variable frequency multiplier
    Patent number: 11444610
    Abstract: A variable frequency multiplier circuit for frequency multiplying an input signal provided by an ultra-low phase noise signal source includes a tone generator configured to generate a multiple tones from the input signal; a signal separating circuit configured to separate the multiple tones into tones of interest and idler tones, where the tones of interest are separated into one or more groups and outputted from the signal separating circuit, and the idler tones are terminated; an amplification circuit configured to amplify each group of the tones of interest to optimize small and large signal responses; and a switched filter bank configured to selectively connect a selected tone from the tones of interest to a circuit output.
    Type: Grant
    Filed: October 30, 2020
    Date of Patent: September 13, 2022
    Assignee: Keysight Technologies, Inc.
    Inventors: Alex Grichener, Naveed Edalati, Leonard M. Weber, Xiaohui Qin, Ryan Michael Avella, David Massie, Stuart Horsburgh, Cameron Blatter, Nicholas Brennan, Michael John Harriman, Andy Ferrara, Harrison Statham, Scott A. Hovland
  • Bond-free interconnect between a microcircuit housing and a printed circuit assembly
    Patent number: 10750617
    Abstract: A method of assembling a fully detachable microcircuit starts with obtaining a fabricated microcircuit housing with an upper surface, a lower surface, a first recess in the upper surface, a second recess in the lower surface, and a pin on the lower surface. A thermal layer is applied to the lower surface. A conductive elastomer signal pin connector and a ground pin connector are attached to a thin film circuit, and the thin film circuit with is inserted into the second recess with the conductive elastomer signal pin connector and the ground pin connector attached. A bonding target is applied to the upper surface. The bonding target and the microcircuit are connected with a bond wire. The microcircuit housing is screwed to a printed circuit assembly without bonding the microcircuit housing to the printed circuit assembly.
    Type: Grant
    Filed: August 21, 2019
    Date of Patent: August 18, 2020
    Assignee: Keysight Technologies, Inc.
    Inventors: Michael John Harriman, Ryan Michael Avella, Leonard M. Weber, Brian R. Hutchison, Naveed Edalati, David Massie, Rodrik Jon Lund, Connie Van Schaick
  • BOND-FREE INTERCONNECT BETWEEN A MICROCIRCUIT HOUSING AND A PRINTED CIRCUIT ASSEMBLY
    Publication number: 20200214139
    Abstract: A method of assembling a fully detachable microcircuit starts with obtaining a fabricated microcircuit housing with an upper surface, a lower surface, a first recess in the upper surface, a second recess in the lower surface, and a pin on the lower surface. A thermal layer is applied to the lower surface. A conductive elastomer signal pin connector and a ground pin connector are attached to a thin film circuit, and the thin film circuit with is inserted into the second recess with the conductive elastomer signal pin connector and the ground pin connector attached. A bonding target is applied to the upper surface. The bonding target and the microcircuit are connected with a bond wire. The microcircuit housing is screwed to a printed circuit assembly without bonding the microcircuit housing to the printed circuit assembly.
    Type: Application
    Filed: August 21, 2019
    Publication date: July 2, 2020
    Inventors: Michael John Harriman, Ryan Michael Avella, Leonard M. Weber, Brian R. Hutchison, Naveed Edalati, David Massie, Rodrik Jon Lund, Connie Van Schaick