Abstract: Described are techniques for improving the functionality of a computing device by regulating the temperature of an energy storage device used to power the computing device. A housing that encloses the energy storage device may include a first portion having a thermal conductivity that exceeds that of a second portion. The first portion may be configured to contact or be positioned proximate to a user's body or other heat-producing object during use. Heat from the user's body or other object may be conducted through the first portion of the housing toward the energy storage device. The less-conductive second portion of the housing may reduce the rate at which heat from the energy storage device is transmitted into the ambient environment. As a result, the temperature of the energy storage device may increase, improving the performance thereof.

Abstract: Various examples are directed to providing thermal management to a computing device. The computing device may receive temperature state data describing a temperature state of the computing device. The temperature state may comprise a first temperature value at a first location at the computing device. The computing device may also receive use state data describing a first use state of the computing device. The first use state may comprise an initial operating condition of a first component of the computing device and an initial operating condition of a second component of the computing device. The computing device may determine that at least one temperature value at the computing device is out-of-range and select a second use state for the computing device. The second use state may comprise at least one of a new operating condition for the first component or a new operating condition of the second component.

Abstract: An electronic device includes an elongated tubular housing. One or more electronic components are coupled to a chassis disposed in a cavity of the tubular housing. A pair of elongated channels are positioned on opposite sides of the chassis and between the chassis and a sidewall of the tubular housing. The channels are tapered or wedge-shaped along their lengths. During assembly, one of the channels may be slid longitudinally along the other, causing the channels to expand laterally, due to their wedge shape, to secure the chassis in the tubular housing. The chassis and the pair of channels provide a thermally conductive path to dissipate heat. During use, heat generated by the electronic components is transmitted radially outward from the electronic components, through the chassis and the pair of channels, and through the tubular housing to the exterior of the portable electronic device.