Abstract: A carrier laser device assembly is provided in which a visible region of a laser that includes an output portion and/or output portion of a waveguide of the laser is visible to an imaging system when the laser is attached to a carrier. The laser may be burned-in and/or tested prior to attachment to a photonic integrated circuit. The output portion and/or output portion of waveguide may be aligned with a corresponding input portion and/or input portion of a waveguide of the PIC as the laser assembly is being attached to the PIC via imaging of the visible portion by the imaging system.

Abstract: A carrier laser device assembly is provided in which a visible region of a laser that includes an output portion and/or output portion of a waveguide of the laser is visible to an imaging system when the laser is attached to a carrier. The laser may be burned-in and/or tested prior to attachment to a photonic integrated circuit. The output portion and/or output portion of waveguide may be aligned with a corresponding input portion and/or input portion of a waveguide of the PIC as the laser assembly is being attached to the PIC via imaging of the visible portion by the imaging system.

Abstract: An example device comprises: a substrate comprising a waveguide material having a waveguide refractive index (RIWG); a first layer of oxide on the substrate having an RI1 lower than the RIWG; a waveguide on the first oxide layer, the waveguide comprising the waveguide material having the RIWG; a second oxide layer on the waveguide and the first oxide layer, the second oxide layer having a second RI2 higher than the RI1 and less than the RIWG, the first oxide layer, the waveguide and the second oxide layer forming an end face for light coupling, and the waveguide extending inwards from the end face and increasing in effective RI from the end face; and an index matching material on the second oxide layer that encapsulates at least the second oxide layer and the end face, a respective RI of the index matching material being about index matched to the RI1.

Abstract: A carrier laser device assembly is provided in which a visible region of a laser that includes an output portion and/or output portion of a waveguide of the laser is visible to an imaging system when the laser is attached to a carrier. The laser may be burned-in and/or tested prior to attachment to a photonic integrated circuit. The output portion and/or output portion of waveguide may be aligned with a corresponding input portion and/or input portion of a waveguide of the PIC as the laser assembly is being attached to the PIC via imaging of the visible portion by the imaging system.

Abstract: An optical ring resonator structure with a backside recess is provided at a device. The device includes: a substrate having a device-side and a backside opposite the device-side; an optical ring resonator located on the device-side of the substrate; a heater having a shape complementary to the optical ring resonator, the heater positioned to heat the optical ring resonator; and one or more metal traces that connect at least to the heater, the metal traces configured to provide power to the heater and extending outward from the heater. The device further includes a recess on the backside of the substrate, the recess centered on the optical ring resonator, and having a diameter larger than both respective outer diameters of the optical ring resonator and the heater, the recess further extending laterally into a region of the one or more metal traces.

Abstract: A photonic integrated chip device having a common optical edge interface is provided and specifically a device comprising: a photonic integrated circuit (PIC) chip comprising: an optical circuit; and an electrical interface configured to receive electrical signals for controlling the optical circuit; and, a common optical interface side of the PIC chip comprising: at least one input configured to receive light into the PIC chip to the optical circuit; and at least one output configured to convey at least one optical signal from the optical circuit out of the PIC chip, the electrical interface located on one or more electrical interface sides of the PIC chip different from the common optical interface side.

Abstract: A device that includes an optical coupler with a waveguide and waveguide index matched materials at an edge of a substrate, and a method of forming the device, is provided herein. The device comprises: a substrate having an edge, and an opening formed therein adjacent the edge; a layer of insulator on the substrate, which forms a bridge across the opening at the edge; a waveguide on the layer of insulator, the waveguide comprising a constant-width region and a tapered region terminating at the edge in a region of the opening; a first layer of optical epoxy in the opening, the optical epoxy indexed matched to the layer of insulator; and, a second layer of the optical epoxy on the tapered region, such that the optical epoxy optically contains an optical signal leaking from the waveguide in the tapered region.

Abstract: A photonic integrated chip device having a common optical edge interface is provided and specifically a device comprising: a photonic integrated circuit (PIC) chip comprising: an optical circuit; and an electrical interface configured to receive electrical signals for controlling the optical circuit; and, a common optical interface side of the PIC chip comprising: at least one input configured to receive light into the PIC chip to the optical circuit; and at least one output configured to convey at least one optical signal from the optical circuit out of the PIC chip, the electrical interface located on one or more electrical interface sides of the PIC chip different from the common optical interface side.

Abstract: A device that includes an optical coupler with a waveguide and waveguide index matched materials at an edge of a substrate, and a method of forming the device, is provided herein. The device comprises: a substrate having an edge, and an opening formed therein adjacent the edge; a layer of insulator on the substrate, which forms a bridge across the opening at the edge; a waveguide on the layer of insulator, the waveguide comprising a constant-width region and a tapered region terminating at the edge in a region of the opening; a first layer of optical epoxy in the opening, the optical epoxy indexed matched to the layer of insulator; and, a second layer of the optical epoxy on the tapered region, such that the optical epoxy optically contains an optical signal leaking from the waveguide in the tapered region.

Abstract: An optical ring resonator structure with a backside recess is provided at a device. The device includes: a substrate having a device-side and a backside opposite the device-side; an optical ring resonator located on the device-side of the substrate; a heater having a shape complementary to the optical ring resonator, the heater positioned to heat the optical ring resonator; and one or more metal traces that connect at least to the heater, the metal traces configured to provide power to the heater and extending outward from the heater. The device further includes a recess on the backside of the substrate, the recess centered on the optical ring resonator, and having a diameter larger than both respective outer diameters of the optical ring resonator and the heater, the recess further extending laterally into a region of the one or more metal traces.

Abstract: An adiabatic elliptical optical coupler device is provided comprising: a substrate having an edge; a first waveguide on the substrate, the first waveguide comprising a constant-width region and a tapered region terminating at the edge of the substrate, the tapered region having a smaller width at the edge than at the constant-width region; and, a pair of second waveguides on the substrate, and located on either side of the tapered region, each of the pair of the second waveguides terminating at the edge at a first end and extending to a second end adjacent the constant-width region, and distal the first end; at least a portion of each of the pair of second waveguides being tapered, and optically coupled to the first waveguide to transition a mode of an optical signal in the first waveguide from an elliptical mode at the edge towards a confined mode.

Abstract: An adiabatic elliptical optical coupler device is provided comprising: a substrate having an edge; a first waveguide on the substrate, the first waveguide comprising a constant-width region and a tapered region terminating at the edge of the substrate, the tapered region having a smaller width at the edge than at the constant-width region; and, a pair of second waveguides on the substrate, and located on either side of the tapered region, each of the pair of the second waveguides terminating at the edge at a first end and extending to a second end adjacent the constant-width region, and distal the first end; at least a portion of each of the pair of second waveguides being tapered, and optically coupled to the first waveguide to transition a mode of an optical signal in the first waveguide from an elliptical mode at the edge towards a confined mode.

Abstract: An asymmetric MEMS thermal actuator device includes a base portion, typically a pair of bond pads, and an actuator element connected to the base portion by a flexure portion. The actuator element has a first arm and a second arm alongside the first arm and spaced from the first arm. The second arm is wider than the first arm so that the actuator element deflects about the flexure element due to differential heating in the first and second arms when an electrical current is passed therethrough. A cut-out portion is provided in the second arm adjacent the first arm so as to increase the spacing therefrom over at least a portion of the second arm. Preferably, a heat sink is also provided laterally adjacent the second arm.

Abstract: An asymmetric MEMS thermal actuator device includes a base portion, typically a pair of bond pads, and an actuator element connected to the base portion by a flexure portion. The actuator element has a first arm and a second arm alongside the first arm and spaced from the first arm. The second arm is wider than the first arm so that the actuator element deflects about the flexure element due to differential heating in the first and second arms when an electrical current is passed therethrough. A cut-out portion is provided in the second arm adjacent the first arm so as to increase the spacing therefrom over at least a portion of the second arm. Preferably, a heat sink is also provided laterally adjacent the second arm.