Patents by Inventor Ryan Ong

Ryan Ong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD AND SYSTEM FOR EYEPIECE WAVEGUIDE DISPLAYS UTILIZING MULTI-DIRECTIONAL LAUNCH ARCHITECTURES
    Publication number: 20250147318
    Abstract: An eyepiece waveguide for augmented reality applications includes a substrate and a set of incoupling diffractive optical elements coupled to the substrate. A first subset of the set of incoupling diffractive optical elements is operable to diffract light into the substrate along a first range of propagation angles and a second subset of the set of incoupling diffractive optical elements is operable to diffract light into the substrate along a second range of propagation angles. The eyepiece waveguide also includes a combined pupil expander diffractive optical element coupled to the substrate.
    Type: Application
    Filed: January 7, 2025
    Publication date: May 8, 2025
    Applicant: Magic Leap, Inc.
    Inventors: Chinmay Khandekar, Robert D. Tekolste, Vikramjit Singh, Victor Kai Liu, Ryan Ong, Kristina Uhlendorf
  • Organic-inorganic hybrid structure for integrated circuit packages
    Patent number: 9754849
    Abstract: An organic-inorganic hybrid structure is described for integrated circuit packages. In one example, an integrated circuit package includes a ceramic frame having a top side and a bottom side, the top side having a pocket with a bottom floor and a plurality of conductive through holes in the bottom floor, an integrated circuit die attached to the bottom floor over the conductive through holes, and a redistribution layer on the bottom side connected to the conductive through holes.
    Type: Grant
    Filed: December 23, 2014
    Date of Patent: September 5, 2017
    Assignee: Intel Corporation
    Inventors: Plory Huang, Henry Su, Chee Key Chung, Ryan Ong, Jones Wang, Daniel Hsieh
  • ORGANIC-INORGANIC HYBRID STRUCTURE FOR INTEGRATED CIRCUIT PACKAGES
    Publication number: 20160181169
    Abstract: An organic-inorganic hybrid structure is described for integrated circuit packages. In one example, an integrated circuit package includes a ceramic frame having a top side and a bottom side, the top side having a pocket with a bottom floor and a plurality of conductive through holes in the bottom floor, an integrated circuit die attached to the bottom floor over the conductive through holes, and a redistribution layer on the bottom side connected to the conductive through holes.
    Type: Application
    Filed: December 23, 2014
    Publication date: June 23, 2016
    Inventors: PLORY HUANG, Henry Su, Chee Key Chung, Ryan Ong, Jones Wang, Daniel Hsieh