Patents by Inventor Ryan P. Murphy

Ryan P. Murphy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230376818
    Abstract: A quantum network may use long-lived quantum memories with optical interfaces incorporated into a scalable architecture. Color-center quantum emitters in diamond have emerged as a promising quantum-memory modality due to their optical properties and compatibility with scalable integration. Here, we disclose a cryogenically stable and network-compatible quantum-emitter module for use as a quantum memory. This quantum-emitter module includes a diamond microchiplet with quantum emitters in the form of silicon vacancies or other color centers. The diamond microchiplet is integrated with a silicon photonic integrated circuit (PIC), which is secured to a silicon bench with cryo-compatible epoxy. Waveguides in the PIC are butt-coupled to optical fibers in a silicon V-groove array, which is secured to the same silicon bench with more cryo-compatible epoxy.
    Type: Application
    Filed: May 18, 2023
    Publication date: November 23, 2023
    Inventors: William John Nowak, John D. Cummings, Paul Benjamin DIXON, Ryan P. Murphy, David Starling