Patents by Inventor Ryan Petersen

Ryan Petersen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240122157
    Abstract: In one or more arrangements, a sweep system for livestock grazing is provided to facilitate movement of livestock when an enclosure is moved. The system includes a frame having a front end, a rear end, and opposing sides. The system has one or more wheel assemblies attached to the frame to facilitate movement of the frame along the ground. The system includes a sweep mechanism connected to the frame that facilitates movement of the livestock.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 18, 2024
    Inventors: Zachary John Smith, Sheldon William Stevermer, Lance Ryan Petersen
  • Publication number: 20210400908
    Abstract: In one or more arrangements, a portable livestock enclosure system is provided to facilitate stock cropping of a field. The system includes a mobile enclosure and one or more enclosed grazing areas. The one or more enclosed grazing areas are operably connected to the mobile enclosure. The mobile enclosure also includes a set of lift wheel assemblies configured to move a set of wheels between a retracted position and an extended position. The mobile enclosure and one or more enclosed grazing areas are lifted off of the ground to facilitate movement of the portable livestock enclosure system when set of wheels are moved to the extended position. The mobile enclosure and one or more enclosed grazing areas are placed on or near the ground when the set of wheels are moved to the retracted position.
    Type: Application
    Filed: June 23, 2021
    Publication date: December 30, 2021
    Inventors: Zachary John Smith, Sheldon William Stevermer, Lance Ryan Petersen
  • Patent number: 11178128
    Abstract: Certain aspects involve facilitating the integration of sensitive data from a data provider into an instance of a web-based, third-party application. For example, a data provider service can receive an authentication API call from a third-party system. The authentication API call can include a user identifier and a request for an access token usable by a web-based interface of the third-party system. The data provider service can generate an access token for the third-party system from which the authentication API call is received. The data provider service can subsequently receive, from the user device, a feature API call including the access token and a feature request for sensitive data. The data provider service can generate output data specific to the user identified by the access token included in the feature API call. The data provider service can provide the output to the user device via the web-based interface.
    Type: Grant
    Filed: January 23, 2020
    Date of Patent: November 16, 2021
    Assignee: EQUIFAX INC.
    Inventors: Timothy G. Poschel, Ryan Petersen, Josh Hanson
  • Publication number: 20200162443
    Abstract: Certain aspects involve facilitating the integration of sensitive data from a data provider into an instance of a web-based, third-party application. For example, a data provider service can receive an authentication API call from a third-party system. The authentication API call can include a user identifier and a request for an access token usable by a web-based interface of the third-party system. The data provider service can generate an access token for the third-party system from which the authentication API call is received. The data provider service can subsequently receive, from the user device, a feature API call including the access token and a feature request for sensitive data. The data provider service can generate output data specific to the user identified by the access token included in the feature API call. The data provider service can provide the output to the user device via the web-based interface.
    Type: Application
    Filed: January 23, 2020
    Publication date: May 21, 2020
    Inventors: Timothy G. POSCHEL, Ryan PETERSEN, Josh HANSON
  • Patent number: 10581825
    Abstract: Certain aspects involve facilitating the integration of sensitive data from a data provider into an instance of a web-based, third-party application. For example, a data provider service can receive an authentication API call from a third-party system. The authentication API call can include a user identifier and a request for an access token usable by a web-based interface of the third-party system. The data provider service can generate an access token for the third-party system from which the authentication API call is received. The data provider service can subsequently receive, from the user device, a feature API call including the access token and a feature request for sensitive data. The data provider service can generate output data specific to the user identified by the access token included in the feature API call. The data provider service can provide the output to the user device via the web-based interface.
    Type: Grant
    Filed: January 29, 2018
    Date of Patent: March 3, 2020
    Assignee: EQUIFAX INC.
    Inventors: Timothy G. Poschel, Ryan Petersen, Josh Hanson
  • Publication number: 20190180235
    Abstract: This disclosure pertains to systems and methods for moving things from a Start Location to an End Location, which provide users with reduced costs, improved logistics, flexibility, a visualized supply chain, and powerful analytics. In some embodiments, the disclosed systems and methods include a user interface which accepts input from a user, then generates and presents a concrete collection of shipping options meeting user-defined route constraints.
    Type: Application
    Filed: May 12, 2017
    Publication date: June 13, 2019
    Inventor: Ryan PETERSEN
  • Publication number: 20180219846
    Abstract: Certain aspects involve facilitating the integration of sensitive data from a data provider into an instance of a web-based, third-party application. For example, a data provider service can receive an authentication API call from a third-party system. The authentication API call can include a user identifier and a request for an access token usable by a web-based interface of the third-party system. The data provider service can generate an access token for the third-party system from which the authentication API call is received. The data provider service can subsequently receive, from the user device, a feature API call including the access token and a feature request for sensitive data. The data provider service can generate output data specific to the user identified by the access token included in the feature API call. The data provider service can provide the output to the user device via the web-based interface.
    Type: Application
    Filed: January 29, 2018
    Publication date: August 2, 2018
    Applicant: EQUIFAX, INC.
    Inventors: Timothy G. Poschel, Ryan Petersen, Josh Hanson
  • Patent number: 8151030
    Abstract: The present invention provides a method of increasing DDR memory bandwidth in DDR SDRAM modules. DDR memory has an inherent feature called the Variable Early Read command, where the read command is issued one CAS latency before the termination of an ongoing data burst By using the Variable Early Read command the effect of the CAS latency is minimized in terms of the effect on bandwidth. The enhanced bandwidth technology achieved with this invention optimizes the remaining two access latencies (tRP and tRCD) for optimal bandwidth. These optimizations in the SPD allow for much better bandwidth in real world applications.
    Type: Grant
    Filed: May 25, 2005
    Date of Patent: April 3, 2012
    Assignee: OCZ Technology Group, Inc.
    Inventors: Ryan Petersen, Franz Michael Schuette
  • Patent number: 7876564
    Abstract: A method and apparatus for cooling chips on a computer memory module. The apparatus includes a primary and secondary heat spreaders, at least a first heatpipe coupled to the primary heat spreader and having a remote portion spaced apart from the primary heat spreader and thermally contacting the secondary heat spreader, and a coolant within the first heatpipe and the primary heat spreader so as to absorb heat from the primary heat spreader and conduct the heat to the secondary heat spreader. The primary heat spreader has at least two panels configured to engage the memory module therebetween, with facing contact surfaces of the panels adapted for thermal contact with the module chips. The secondary heat spreader is configured to increase surface dissipation of heat from the first heatpipe into the environment. The coolant has a boiling point at or below a maximum preselected operating temperature of the module chips.
    Type: Grant
    Filed: May 27, 2008
    Date of Patent: January 25, 2011
    Assignee: CCZ Technology Group, Inc.
    Inventors: Mohasit Monh, Ryan Petersen
  • Publication number: 20080291630
    Abstract: A method and apparatus for cooling chips on a computer memory module. The apparatus includes a primary and secondary heat spreaders, at least a first heatpipe coupled to the primary heat spreader and having a remote portion spaced apart from the primary heat spreader and thermally contacting the secondary heat spreader, and a coolant within the first heatpipe and the primary heat spreader so as to absorb heat from the primary heat spreader and conduct the heat to the secondary heat spreader. The primary heat spreader has at least two panels configured to engage the memory module therebetween, with facing contact surfaces of the panels adapted for thermal contact with the module chips. The secondary heat spreader is configured to increase surface dissipation of heat from the first heatpipe into the environment. The coolant has a boiling point at or below a maximum preselected operating temperature of the module chips.
    Type: Application
    Filed: May 27, 2008
    Publication date: November 27, 2008
    Applicant: OCZ TECHNOLOGY GROUP, INC.
    Inventors: Mohasit Monh, Ryan Petersen
  • Publication number: 20080049960
    Abstract: A gaming headset adapted for precise delivery of chemical substances capable of olfactory stimulation, such as odorants, fragrances, pheromones, etc. The headset includes at least one earpiece containing a speaker, a feature for securing the earpiece to the person's head while positioning the speaker over one of the person's ears when the headset is worn, an armature disposed relative to the earpiece so as to extend toward the person's mouth, a microphone located on the armature so as to be located in front of the person's mouth, and a feature supported by and extending along the armature for delivering at least one chemical substance to the person's nostril's when the headset is worn.
    Type: Application
    Filed: August 28, 2007
    Publication date: February 28, 2008
    Applicant: OCZ TECHNOLOGY GROUP, INC.
    Inventors: Ryan Petersen, Franz Schuette
  • Publication number: 20070159789
    Abstract: A heat spreader and method for thermal management of a computer memory module by promoting natural convection cooling of the memory module. The heat spreader includes a frame surrounding a planar body adapted to be mounted to a memory module of a computer, and a grid defined in the planar body by a plurality of uniformly distributed perforations. The perforations extend through the planar body to allow natural convention between an interior space beneath the planar body and an exterior space above the planar body.
    Type: Application
    Filed: January 9, 2007
    Publication date: July 12, 2007
    Applicant: OCZ TECHNOLOGY GROUP, INC.
    Inventors: Franz Schuette, Ryan Petersen, Eric Nelson, Bhulinder Sethi
  • Publication number: 20070005902
    Abstract: A memory module having at least one random access memory device and a memory bus on a substrate. The memory module further comprises an SRAM cache interfaced with the random access memory device through an ASIC associated with the SRAM cache and operable as a prefetch controller for the SRAM cache. The ASIC and SRAM cache cooperate to enable data to be prefetched and cached during idle cycles of the memory device, thereby increasing the overall operating speed of the memory circuit by minimizing latencies should the prefetched data be requested. The ASIC can be programmed to prefetch not only data from the originally accessed row during a read operation, but also to speculatively prefetch data from logically coherent rows in order to anticipate and counteract a page miss and the associated latencies based on the locality of data.
    Type: Application
    Filed: December 7, 2005
    Publication date: January 4, 2007
    Applicant: OCZ TECHNOLOGY GROUP, INC.
    Inventors: Ryan Petersen, Franz Schuette
  • Publication number: 20060212645
    Abstract: A mass storage device having at least one flash memory device and DRAM or SRAM-based cache within a package, and which comprises co-processor means within the package for performing compression and decompression of cached data before writing the cached data to the flash memory device.
    Type: Application
    Filed: December 7, 2005
    Publication date: September 21, 2006
    Applicant: OCZ TECHNOLOGY GROUP, INC.
    Inventors: Ryan Petersen, Franz Schuette
  • Publication number: 20060056214
    Abstract: A memory module capable of exhibiting reduced input clock skew. More particularly, an unbuffered memory module that comprises a substrate, multiple memory components mounted to the substrate, and input/output and address and command bus connectors that transmit digital information to and from the memory components further includes a phase lock loop (PLL) circuit that electrically interconnects a clock-in connector to the memory components for generating and transmitting a module clock signal to the memory components without routing any information to the memory components through a register. In this manner, the PLL operates to provide the memory module with an onboard clock generator that synchronizes the memory components of the module.
    Type: Application
    Filed: August 24, 2005
    Publication date: March 16, 2006
    Applicant: OCZ TECHNOLOGIES, INC.
    Inventors: Ryan Petersen, Eric Nelson
  • Publication number: 20060056215
    Abstract: A memory module adapted for installation in an open memory socket on a mainboard of a computer. The memory module includes a substrate with an edge connector comprising pins along an edge of the substrate, and at least one memory package mounted to the substrate and containing a memory die electrically connected to input/output leads located along the perimeter of the memory package and through which data signals are transmitted to and from the memory die. Data signal lines electrically connect a plurality of the input/output leads of the memory package to a plurality of the pins of the edge connector. Termination resistors individually electrically connect each of the data signal lines to ground, a supply voltage, or a reference voltage of the memory package so as to reduce noise and signal reflections through the data signal lines.
    Type: Application
    Filed: August 25, 2005
    Publication date: March 16, 2006
    Applicant: OCZ TECHNOLOGY GROUP, INC.
    Inventors: Ryan Petersen, Franz Schuette
  • Publication number: 20050266711
    Abstract: A method and apparatus for providing power to a memory array of a computer's memory subsystem, and more particularly power at a level greater than that available through the computer motherboard so as to boost memory performance and operational stability. The apparatus includes a supply device for supplying an input voltage to the memory subsystem at a level that is higher than the power level provided to the memory subsystem by the motherboard. The method entails electrically connecting the supply device to the memory subsystem, and then electrically connecting a power source to the device to deliver the input voltage to the memory subsystem. The additional input voltage supplied to the memory subsystem causes memory chips on memory modules of the memory subsystem to run at higher frequencies, such that the various internal operations of the memory, such as reading and writing, occur more quickly.
    Type: Application
    Filed: September 29, 2004
    Publication date: December 1, 2005
    Applicant: OCZ TECHNOLOGY
    Inventors: Ryan Petersen, Eric Nelson
  • Publication number: 20050226076
    Abstract: An apparatus for buffering power transients in a supply power for expansion cards inserted into expansion slots on a computer motherboard. The apparatus comprises a printed circuit board, a connector on the printed circuit board, and at least one capacitor on the printed circuit board. The connector is configured to fit into one of the expansion slots on the motherboard, and comprises at least one power pin and at least one ground pin. The at least one capacitor is connected to the power and ground pins of the connector and has sufficient capacitance to buffer power transients within the supply power to the expansion slots.
    Type: Application
    Filed: March 31, 2005
    Publication date: October 13, 2005
    Applicant: OCZ TECHNOLOGY GROUP, INC.
    Inventor: Ryan Petersen