Abstract: The present invention provides a chucking station apparatus for removing a semiconductor workpiece positioned within a chuck, which includes a retainer member and a support member. The chucking station includes an upper assembly and a lower assembly operably connected to the upper assembly by an actuator assembly. The lower assembly has a receiver that receives the chuck and the workpiece residing between the retainer and support members. When the upper and lower assemblies are in the closed position, a separator element of the lower assembly exerts a force upon an outer periphery of the support member to disengage it from the retainer member. In an open position where the upper and lower assemblies are spaced a distance apart, the support member is disconnected from the retainer member to expose the workpiece. A release assembly of the lower assembly elevates the workpiece to present it for removal from the chucking station.

Abstract: An apparatus for processing a workpiece, such as a semiconductor wafer, includes a rotor for holding workpieces within a process chamber. A gas pressure seal around the shaft of the rotor has a shaft adapter on the shaft and an o-ring providing a seal between the shaft and the shaft adapter. A front o-ring seals the shaft adapter directly to the back surface of the rotor. A motor ring around the shaft adapter is spaced apart from the shaft adapter to form an annular gas flow path between them. A retainer ring attached to the motor ring is sealed against the motor ring by a motor ring o-ring. An inert gas source is connected to a gas inlet on the motor ring and provides a flow of gas through the seal during workpiece processing. This prevents process gases in the chamber from leaking out and also prevents contaminants from leaking into the chamber. The flow of inert gas can be reduced temporarily to avoid dilution of the process gas in the chamber.

Abstract: A system for processing semiconductor wafers has process units on a deck of a frame. The process units and the deck have precision locating features, such as tapered pins, for precisely positioning the process units on the deck. Process units can be removed and replacement process units installed on the deck, without the need for recalibrating the load/unload robot. This reduces the time needed to replace process units and restart processing operations. Liquid chemical consumption during processing is reduced by drawing unused liquid out of supply lines and pumping it back to storage.

Abstract: A system for processing semiconductor wafers has process units on a deck of a frame. The process units and the deck have precision locating features, such as tapered pins, for precisely positioning the process units on the deck. Process units can be removed and replacement process units installed on the deck, without the need for recalibrating the load/unload robot. This reduces the time needed to replace process units and restart processing operations. Liquid chemical consumption during processing is reduced by drawing unused liquid out of supply lines and pumping it back to storage.