Abstract: A system according to one embodiment includes a first computing device comprising ultra-wideband communication circuitry, and a second computing device comprising ultra-wideband communication circuitry configured to communicate with the ultra-wideband communication circuitry of the first computing device to determine the angle and distance of the first computing device relative to the second computing device.

Abstract: Some embodiments include an integrated structure having vertically-stacked conductive levels alternating with dielectric levels. A layer over the conductive levels includes silicon, nitrogen, and one or more of carbon, oxygen, boron and phosphorus. In some embodiments the vertically-stacked conductive levels are wordline levels within a NAND memory array. Some embodiments include an integrated structure having vertically-stacked conductive levels alternating with dielectric levels. Vertically-stacked NAND memory cells are along the conductive levels within a memory array region. A staircase region is proximate the memory array region. The staircase region has electrical contacts in one-to-one correspondence with the conductive levels. A layer is over the memory array region and over the staircase region. The layer includes silicon, nitrogen, and one or more of carbon, oxygen, boron and phosphorus.

Abstract: Described herein are connector components for selectively connecting to a PCB or other type of secondary device. Such a connector component comprises a body, electrically conductive contact pins, and latching pins. The body includes opposing sides at which are located pinch tabs. The electrically conductive contact pins and the latching pins each includes a portion thereof also extending from the bottom of the body. The pinch tabs are configured to normally bias the latching pins in a first position where the latching pins are angled relative to a central axis of the connector component when the pinch tabs are not being pinched inwards towards one another. Additionally, the pinch tabs are configured to bias the latching pins in a second position where the latching pins are substantially parallel to the central axis of the connector component when the pinch tabs are being pinched inward towards one another.

Abstract: Described herein are connector components for selectively connecting to a PCB or other type of secondary device. Such a connector component comprises a body, electrically conductive contact pins, and latching pins. The body includes opposing sides at which are located pinch tabs. The electrically conductive contact pins and the latching pins each includes a portion thereof also extending from the bottom of the body. The pinch tabs are configured to normally bias the latching pins in a first position where the latching pins are angled relative to a central axis of the connector component when the pinch tabs are not being pinched inwards towards one another. Additionally, the pinch tabs are configured to bias the latching pins in a second position where the latching pins are substantially parallel to the central axis of the connector component when the pinch tabs are being pinched inward towards one another.

Abstract: Methods and mechanisms for mixing and dispensing multipart materials is provided. The methods and mechanisms may be used for mix on demand operations as well as for encapsulation of electronic components. The methods and mechanisms may incorporate a mixer assembly from which material is substantially directly dispensed. The methods and mechanisms may incorporate mix on demand where first and second material supply sources include pumping arrangements for pumping first and second materials through a mixing arrangement. The pumping forces provided by the pumping arrangements also provide the force to dispense the mixed material where it will ultimately be formed, such as a potting location or a mold.

Abstract: A valve assembly including a valve body, a sleeve member and a valve member is provided. A low shear sleeve member is positioned within an internal cavity of the valve body. The valve member is slidably carried within an internal cavity of the sleeve member. The valve member includes a first flow passage formed within the valve member and a first shut-off region. The valve member is moveable between a first position in which fluid flow from a first sleeve member inlet port to a first sleeve member outlet port is prohibited and a second position in which fluid flow from the first sleeve member inlet port to the first sleeve member outlet port is permitted. Delivery systems incorporating the valve assembly are also provided.

Abstract: A static mixer is provided. The static mixer includes a plurality of static mixer elements. Each static mixer element includes a core extending axially along a longitudinal axis between a first end and a second end. Each static mixer element includes at least one blade around an outside of the core. At least a first one of the plurality of static mixer elements includes a first keying feature. At least a second one of the plurality of static mixer elements including a second keying feature configured to engage the first keying feature to prevent relative rotation between the first one of the plurality of static mixer elements and the second one of the plurality of static mixer elements about the longitudinal axes of the first one and the second one of the plurality of static mixer elements. Methods of forming the static mixer are also provided.

Abstract: A thermal reservoir including a melting section and a heating arrangement is provided. A method of assembling is also provided. The melting section includes a plurality of material flow sections. Each material flow section includes a central cavity extending axially therethrough between first and second ends along a central longitudinal axis. The plurality of material flow sections are operably removably connected together with the central cavities thereof aligned and in fluid communication to form a material flow path extending through all of the connected material flow sections. The heating arrangement cooperates with the plurality of material flow sections to provide heat for heating a material to be passed through the material flow path.

Abstract: A thermal reservoir including a heating section and an upper section is provided. The upper section defines a storage cavity. The upper section is formed from an insulated, non-stick or insulated non-stick material. The upper section is fluidly connected to the heating section and upstream from the heating section for receiving material to be heated prior to the heating section.