Abstract: A method of packaging a semiconductor component with a printed wiring board is disclosed. The method includes determining a first distance, applying a thin film onto a surface of the semiconductor component such that the thin film is spaced apart from a support of the semiconductor, applying a solder pad onto the printed wiring board, placing the semiconductor component with the thin film onto the printed wiring board, and positioning the thin film adjacent the solder pad.

Abstract: A rugged hard disk drive storage assembly is disclosed. The rugged hard disk drive storage assembly includes an enclosure capable of containing multiple hard disk drives. The enclosure also contains multiple shock and vibration absorbers that are configured to elastically support all the hard disk drives contained within the enclosure. The multiple shock absorbers protect the delicate electronic hard disk drives and their sensitive information from shock and vibration damage, even when the enclosure has been removed from the drive container, and is being carried away by personal in a harsh combat environment. In addition, the enclosure is hermetically sealed such that the hard disk drives are isolated from external environment.

Abstract: A method of packaging a semiconductor component with a printed wiring board is disclosed. The method includes determining a first distance, applying a thin film onto a surface of the semiconductor component such that the thin film is spaced apart from a support of the semiconductor, applying a solder pad onto the printed wiring board, placing the semiconductor component with the thin film onto the printed wiring board, and positioning the thin film adjacent the solder pad.