Abstract: One or more devices are provided that are configured to detachably engage within a modular system. The one or more devices are expandable to provide a surface to perform work.

Abstract: Method and system for a wet/wet differential pressure sensor based on microelectronic packaging process. A top cap with a hole can be attached to a topside of a MEMS-configured pressure sense die with a pressure sensing diaphragm in order to allow sensed media to come in contact with the topside of the pressure sensing diaphragm. An optional constraint with a hole for stress relief can be attached to a backside of the pressure sense die. Adhesive and/or elastomeric seals and/or solder can be utilized to seal the pressure sense die allowing sensed media to come in contact with both sides of the pressure sensing diaphragm without coming into contact with wirebonds and other metallized surfaces. The MEMS-configured pressure sense die can also be bonded to a substrate with standard die attach materials. Such microelectronic packaging processes yield a high performance and cost effective solution thereby providing wet-wet pressure sensing capability.

Abstract: Method and system for a wet/wet differential pressure sensor based on microelectronic packaging process. A top cap with a hole can be attached to a topside of a MEMS-configured pressure sense die with a pressure sensing diaphragm in order to allow sensed media to come in contact with the topside of the pressure sensing diaphragm. An optional constraint with a hole for stress relief can be attached to a backside of the pressure sense die. Adhesive and/or elastomeric seals and/or solder can be utilized to seal the pressure sense die allowing sensed media to come in contact with both sides of the pressure sensing diaphragm without coming into contact with wirebonds and other metallized surfaces. The MEMS-configured pressure sense die can also be bonded to a substrate with standard die attach materials. Such microelectronic packaging processes yield a high performance and cost effective solution thereby providing wet-wet pressure sensing capability.

Abstract: A powered shingle ripper with a rocker assembly having a serrated blade. The rocker assemble is eccentrically mounted for rotation about an axis in a manner that the leading edge of the serrated blade reciprocates back and forth and up and down. Rotation of the rocker assembly about the axis is confined to a predetermined arc, the orientation of which may be under operator control.

Abstract: A method of incorporating compliant pins in a pressure sensor that uses PCB (printed circuit board) and is press fitted into the compliant pins. The compliant pins are made in the leadframe and the leadframes are molded into the plastic housing. The PCB is press fitted to the leadframe/housing assembly.

Abstract: A method of incorporating compliant pins in a pressure sensor that uses PCB (printed circuit board) and is press fitted into the compliant pins. The compliant pins are made in the leadframe and the leadframes are molded into the plastic housing. The PCB is press fitted to the leadframe/housing assembly.