Abstract: A package and integrated circuit assembly is configured to perform signal conditioning on a signal. The assembly includes a line card having line card contacts that correspond to conductors in the line card connector. Two or more integrated circuits are configured to perform signal conditioning on the signal and the two or more integrated circuits are configured within a package into at least a first row and a second row on the package. The package includes a grid array of bonding pads to electrically connect to the two or more integrated circuits through bond wires or down bonds such that the structure of the grid array corresponds in physical arrangement or bond pad pitch to the line card contacts. This assembly also includes an electrical connection from the two or more integrated circuits to the line card through the package.

Abstract: A package and integrated circuit assembly is configured to perform signal conditioning on a signal. The assembly includes a line card having line card contacts that correspond to conductors in the line card connector. Two or more integrated circuits are configured to perform signal conditioning on the signal and the two or more integrated circuits are configured within a package into at least a first row and a second row on the package. The package includes a grid array of bonding pads to electrically connect to the two or more integrated circuits through bond wires or down bonds such that the structure of the grid array corresponds in physical arrangement or bond pad pitch to the line card contacts. This assembly also includes an electrical connection from the two or more integrated circuits to the line card through the package.

Abstract: Certain pins of an XFP connector are re-purposed to enable the connector to receive, for example, four 11.88 Gb/s serial data streams (for a receiver), or output four 11.88 Gb/s serial data streams (for a transmitter). The four data streams are wavelength division multiplexed inside the XFP module for transmission over a single optical fiber, providing a total interface capacity of 47.52 Gb/s. An XFP receiver module is defined to convert the WDM signal back to four 11.88 Gb/s serial data streams.

Abstract: Systems and methods for conditioning an optical signal are provided for applications which require management of both low and high-data-rates. Upon receipt of a data signal, a determination is made as to whether the data signal is a high or low-data-rate signal. If the data signal is a high-data-rate signal, a clock and data recovery circuit is activated along the data path. If the data signal is a low-data-rate signal, the clock and data recovery circuit is bypassed. When activated, the clock and data recovery circuit conditions the data signal to reduce jitter and other distortion effects which tend to produce larger detrimental effects as data rates increase.

Abstract: Certain pins of an XFP connector are re-purposed to enable the connector to receive, for example, four 11.88 Gb/s serial data streams (for a receiver), or output four 11.88 Gb/s serial data streams (for a transmitter). The four data streams are wavelength division multiplexed inside the XFP module for transmission over a single optical fibre, providing a total interface capacity of 47.52 Gb/s. An XFP receiver module is defined to convert the WDM signal back to four 11.88 Gb/s serial data streams.