Patents by Inventor Ryan S. Tidwell

Ryan S. Tidwell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Radius filler containing vertical ply stacks and thin plies
    Patent number: 9463864
    Abstract: A radius filler for a composite assembly may include a pair of vertical ply stacks positioned in back-to-back relation. Each one of the vertical ply stacks may be formed of one or more thick plies of composite material formed in an L-shaped cross-section having a vertical leg and a lateral leg interconnected by a stack radius and defining a crescent region. At least one of the crescent regions may include one or more thin plies of composite material positioned adjacent to a stack radius inner surface. Each one of the thin plies may have a ply thickness that is less than the ply thickness of the thick plies.
    Type: Grant
    Filed: July 28, 2015
    Date of Patent: October 11, 2016
    Assignee: The Boeing Company
    Inventors: Douglas A. McCarville, Jordan O. Birkland, Ryan S. Tidwell, Juan C. Guzman