Patents by Inventor Ryan SANDEN

Ryan SANDEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • EMBEDDED COMPONENT INTERPOSER OR SUBSTRATE COMPRISING DISPLACEMENT COMPENSATION TRACES (DCTs) AND METHOD OF MAKING THE SAME
    Publication number: 20250372395
    Abstract: A substrate comprising a region of displacement compensation traces (DCTs), a component comprising conductive contacts, interconnect pads formed in an interconnect pad region over the component according to a nominal design position, first and second embedded components, and a region of DCTs comprising at least one arrangement of DCTs with unit specific patterning such that the arrangement of DCTs is coupled to, and extends between, the conductive contacts and the interconnect pads.
    Type: Application
    Filed: August 18, 2025
    Publication date: December 4, 2025
    Inventors: Craig BISHOP, Andrew HOETKER, Ryan SANDEN, Paul R. HOFFMAN, Timothy L. OLSON
  • Embedded component interposer or substrate comprising displacement compensation traces (DCTs) and method of making the same
    Patent number: 12424450
    Abstract: A method of making a substrate comprising an embedded component and further comprising a region of displacement compensation traces (DCTs) may comprise the following. A component comprising conductive contacts. Measuring a shift of the component. Forming a plurality of interconnect pads over the component according to a nominal design position. Forming the region of DCTs may comprise at least one arrangement of DCTs with unit specific patterning such that the arrangement of DCTs is coupled to, and extends between, the conductive contacts and the interconnect pads. The arrangement of DCTs may compensate for the measured shift of the component and a majority of the arrangement of DCTs does not extend beyond a shared footprint of the component and the interconnect pad region.
    Type: Grant
    Filed: November 20, 2024
    Date of Patent: September 23, 2025
    Assignee: Deca Technologies USA, Inc.
    Inventors: Craig Bishop, Andrew Hoetker, Ryan Sanden, Paul R. Hoffman, Timothy L. Olson
  • EMBEDDED COMPONENT INTERPOSER OR SUBSTRATE COMPRISING DISPLACEMENT COMPENSATION TRACES (DCTs) AND METHOD OF MAKING THE SAME
    Publication number: 20250167003
    Abstract: A method of making a substrate comprising an embedded component and further comprising a region of displacement compensation traces (DCTs) may comprise the following. A component comprising conductive contacts. Measuring a shift of the component. Forming a plurality of interconnect pads over the component according to a nominal design position. Forming the region of DCTs may comprise at least one arrangement of DCTs with unit specific patterning such that the arrangement of DCTs is coupled to, and extends between, the conductive contacts and the interconnect pads. The arrangement of DCTs may compensate for the measured shift of the component and a majority of the arrangement of DCTs does not extend beyond a shared footprint of the component and the interconnect pad region.
    Type: Application
    Filed: November 20, 2024
    Publication date: May 22, 2025
    Inventors: Craig BISHOP, Andrew HOETKER, Ryan SANDEN, Paul R. HOFFMAN, Timothy L. OLSON