Abstract: An apparatus comprising a first substrate, a second substrate, a bonding layer positioned between the first substrate and the second substrate, the bonding layer holding the first substrate and the second substrate together, and a reactive layer embedded in the bonding layer. The reactive layer can generate sufficient thermal energy to cause the first substrate to separate from the second substrate without damaging at least one of the first substrate or the second substrate when the reactive layer is activated, and is preferably comprised of a reactive multilayer foil.

Abstract: An item, such as a sputtering target assembly or an electrostatic chuck, comprised of a first substrate; a metallization layer adhered to a surface of the first substrate; a second substrate; and an elastomer layer positioned between the metallization layer and the second substrate. In another embodiment, a debonding layer, such as a solder material, is positioned between the elastomer layer and the second substrate for allowing the item to be disassembled after use by heating the item up to the approximate melting point of the debonding layer.

Abstract: The present invention includes a long cylindrical sputtering target assembly and a method for manufacturing the assembly. The long cylindrical sputtering target assembly comprises a cylindrical sputtering target having a length greater than approximately thirty-six inches and being comprised of one or more cylindrical sputtering target sections; a cylindrical backing tube; and an attachment layer, such as indium, positioned between the cylindrical sputtering target and the cylindrical backing tube for attaching the cylindrical sputtering target to the cylindrical backing tube.

Abstract: The present invention includes an assembly comprised of a large sputtering target attached to a backing plate by an elastomer, such as a silicone elastomer, and a method for attaching the large sputtering target to the backing plate using the elastomer as an attachment layer. The method of the present invention comprises the steps of applying a quantity of the elastomer to the backing plate and/or to the sputtering target, where the sputtering target has a sputtering surface having a surface area greater than 6600 square centimeters. The backing plate and the sputtering target are then brought together either with or without a thermal transfer member positioned between the backing plate and the sputtering target.