Patents by Inventor Ryan Stempek

Ryan Stempek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190021383
    Abstract: Provided is a composition which comprises (a) okara or whole soy or a mixture thereof, and (b) a fiber-containing pectin product or pectin, wherein the weight ratio between components (a) and (b) is from 0.1:1 to 75:1. The composition is useful for increasing the cohesion of solid food, such as soy patties.
    Type: Application
    Filed: March 28, 2017
    Publication date: January 24, 2019
    Inventors: Puspendu Deo, Yongfu Li, Tirtha Chatterjee, Ryan Stempek