Abstract: A glass-reinforced fluoropolymer composition has increased flexural strength and includes a first fluoropolymer, a second fluoropolymer, and glass fibers. The first fluoropolymer is present in an amount of from 60 to 99 parts by weight per 100 parts by weight of the glass-reinforced fluoropolymer composition. The second fluoropolymer is chosen from (1) a carboxy- and/or anhydride-functionalized perfluoroalkoxy copolymer, (2) a carboxy- and/or anhydride-functionalized poly(ethylene-co-tetrafluoroethylene) copolymer, and (3) combinations thereof. The second fluoropolymer is present in an amount of from 0.5 to 39.5 parts by weight per 100 parts by weight of the glass-reinforced fluoropolymer composition. The glass fibers are present in an amount of from 0.5 to 39.5 parts by weight per 100 parts by weight of the glass-reinforced fluoropolymer composition.

Abstract: A fluorinated copolymer composition includes a thermoplastic resin A and a fluorinated elastomer B dispersed within thermoplastic resin A. Thermoplastic resin A has a shear stress (?A) of greater than 0.11 MPa when measured with a capillary rheometer at a shear rate of 243 sec?1 and at 360° C. in accordance with ASTM D3835. Fluorinated elastomer B dispersed within thermoplastic resin A has an average dispersed particle size of less than 50 ?m.

Abstract: A fluorinated copolymer composition includes a thermoplastic resin A and a fluorinated elastomer B dispersed within thermoplastic resin A. Thermoplastic resin A has a shear stress (?A) of greater than 0.11 MPa when measured with a capillary rheometer at a shear rate of 243 sec?1 and at 360° C. in accordance with ASTM D3835. Fluorinated elastomer B dispersed within thermoplastic resin A has an average dispersed particle size of less than 50 ?m.

Abstract: The invention relates to the use in a photovoltaic module of a film of a composition as a backsheet or as an encapsulant, this composition comprising, with respect to the total weight of the composition: from 1 to 99% of a polyethylene having an ethylene whose level by weight is greater than or equal to 80% chosen from the homopolymers of ethylene and the copolymers of ethylene and another alpha-olefin; from 99 to 1% of a polyolefin B, other than A, carrying a reactive functional group X chosen from the anhydride carboxylic acids and epoxides. The invention also relates to, the composition additionally comprises a polyolefin C, other than B, which carries a functional group Y capable of reacting with the functional group X. The invention further relates to a photovoltaic module comprising the film which is used of the composition and also a process for the manufacture of this module.

Abstract: An encapsulant composition containing about 15 to about 50 wt % of an ethylene/ethyl acrylate/maleic anhydride copolymer containing about 20 to about 40 wt % of an ethylene/glycidyl (meth)acrylate copolymer; about 2 to about 30 wt % of an ethylene/butyl acrylate/maleic anhydride copolymer; about 5 to about 50 wt % of polyethylene, about 0.05 to about 5 wt % of an adhesion promoter; and optionally about 0.01 to about 2 wt % of at least one additive. The composition is useful for encapsulating thin film devices. The disclosure also relates to a method of encapsulating thin film devices with the composition and to devices produced by the method.

Abstract: An encapsulant composition containing about 15 to about 50 wt % of an ethylene/ethyl acrylate/maleic anhydride copolymer containing about 20 to about 40 wt % of an ethylene/glycidyl (meth)acrylate copolymer; about 2 to about 30 wt % of an ethylene/butyl acrylate/maleic anhydride copolymer; about 5 to about 50 wt % of polyethylene, about 0.05 to about 5 wt % of an adhesion promoter; and optionally about 0.01 to about 2 wt % of at least one additive. The composition is useful for encapsulating thin film devices. The disclosure also relates to a method of encapsulating thin film devices with the composition and to devices produced by the method.