Patents by Inventor Ryan Tong

Ryan Tong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTRICALLY HEATED SUBSTRATES, ASSEMBLIES, SYSTEMS, AND PROCESSES FOR CATALYTIC, CHEMICAL, AND SORBENT APPLICATIONS
    Publication number: 20250058308
    Abstract: An article for joule heating is described, including a three-dimensional substrate on and/or in which a pyrolyzate of a phenolic resin or polymer forms an electrically conductive carbon network. Such articles may be incorporated in structured materials applications, which may include support, sorbent, and or catalyst components.
    Type: Application
    Filed: August 20, 2024
    Publication date: February 20, 2025
    Inventors: Jian Ping SHEN, Raghubir Prasad GUPTA, Vasudev Pralhad HARIBAL, Andrew TONG, Jonathan Edwin PETERS, Monica Jayne ABDALLAH, Ryan Patrick ZELINSKY
  • Load vectoring heat sink
    Patent number: 11991864
    Abstract: A heat sink includes multiple load points and a plurality of load cell for each of the load points. Each of the load cells is configured to attach to a respective attachment point on a component and to create a tensile load between the respective attachment point of the component and a respective one of the load points of the heat sink. At least one of the load cells is configured to produce a different maximum tensile load than another load cell among the plurality of load cells.
    Type: Grant
    Filed: March 16, 2022
    Date of Patent: May 21, 2024
    Assignee: Google LLC
    Inventor: Ryan Tong
  • Load Vectoring Heat Sink
    Publication number: 20230301029
    Abstract: A heat sink includes multiple load points and a plurality of load cell for each of the load points. Each of the load cells is configured to attach to a respective attachment point on a component and to create a tensile load between the respective attachment point of the component and a respective one of the load points of the heat sink. At least one of the load cells is configured to produce a different maximum tensile load than another load cell among the plurality of load cells.
    Type: Application
    Filed: March 16, 2022
    Publication date: September 21, 2023
    Inventor: Ryan Tong
  • Heatsink and stiffener mount with integrated alignment
    Patent number: 11071195
    Abstract: A mount for connecting a heat sink to a PCB may include a threaded post extending along an axis, a first barrel adjacent to the post along an axis and having a larger axial cross-section than the post, and a threaded second barrel defining an opposite end of the mount from the post and having a larger axial cross-section than the first barrel.
    Type: Grant
    Filed: August 27, 2020
    Date of Patent: July 20, 2021
    Assignee: Google LLC
    Inventor: Ryan Tong