Patents by Inventor Ryan Tordillo Comadre

Ryan Tordillo Comadre has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-layer interconnection ribbon
    Patent number: 11705387
    Abstract: A semiconductor package assembly includes a carrier with a die attach surface and a contact pad separated from the die attach surface, a semiconductor die mounted on the die attach surface, the semiconductor die having a front side metallization that faces away from the die attach surface, an interconnect ribbon attached to the semiconductor die and the contact pad such that the interconnect ribbon electrically connects the front side metallization to the contact pad, and an electrically insulating encapsulant body that encapsulates the semiconductor die and at least part of the interconnect ribbon. The interconnect ribbon includes a layer stack of a first metal layer and a second layer formed on top of the first metal layer. The first metal layer includes a different metal as the second metal layer. The first metal layer faces the front side metallization.
    Type: Grant
    Filed: September 2, 2020
    Date of Patent: July 18, 2023
    Assignee: Infineon Technologies AG
    Inventors: Emil Lamco Jocson, Mohd Kahar Bajuri, Ryan Tordillo Comadre
  • Semiconductor Package with Blind Hole Attachment to Heat Sink
    Publication number: 20230125452
    Abstract: A semiconductor package includes a lead frame that includes a die pad and a plurality of leads, a semiconductor die mounted on a die attach surface of the die pad, an encapsulant body of electrically insulating material that covers semiconductor die and portions of the lead frame, and a fastener receptacle that includes a blind hole in the encapsulant body or the die pad, wherein a rear surface of the die pad is exposed from a first main face of the encapsulant body.
    Type: Application
    Filed: October 25, 2021
    Publication date: April 27, 2023
    Inventors: Ryan Tordillo Comadre, Victor Dela Cruz Del Rosario, Bernie Tabanao Rosales, Subaramaniym Senivasan, Heng Chen Tang
  • Multi-Layer Interconnection Ribbon
    Publication number: 20220068770
    Abstract: A semiconductor package assembly includes a carrier with a die attach surface and a contact pad separated from the die attach surface, a semiconductor die mounted on the die attach surface, the semiconductor die having a front side metallization that faces away from the die attach surface, an interconnect ribbon attached to the semiconductor die and the contact pad such that the interconnect ribbon electrically connects the front side metallization to the contact pad, and an electrically insulating encapsulant body that encapsulates the semiconductor die and at least part of the interconnect ribbon. The interconnect ribbon includes a layer stack of a first metal layer and a second layer formed on top of the first metal layer. The first metal layer includes a different metal as the second metal layer. The first metal layer faces the front side metallization.
    Type: Application
    Filed: September 2, 2020
    Publication date: March 3, 2022
    Inventors: Emil Lamco Jocson, Mohd Kahar Bajuri, Ryan Tordillo Comadre