Patents by Inventor Ryan Verhulst

Ryan Verhulst has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240417612
    Abstract: A phase-changing thermally conductive composition includes a non-silicone resin and a thermally stable antioxidant having a melting point temperature of between 4° and 85° C. The thermally stable antioxidant acts as a phase-changing component of the composition. The phase-changing thermally conductive composition further includes thermally conductive particulate filler, such that the composition exhibits a thermal conductivity of at least 1 W/m*K and less than 20% weight loss after 1000 hours at 175 ° C.
    Type: Application
    Filed: August 28, 2024
    Publication date: December 19, 2024
    Inventors: Radesh Jewram, Matthew Bren, Ryan Verhulst
  • Publication number: 20240400880
    Abstract: A phase-changing thermal interface material includes a non-silicone resin and a plasticizer that is compatible with the phase changing material and is capable of wetting the thermally conductive particulate filler. The filler is incorporated with the resin to an extent sufficient to provide a material with a thermal impedance of less than 0.1° C.*cm2/W. The thermal interface material exhibits a melting point of between 40 and 80° C., and a melt viscosity of less than 105 Pa*s.
    Type: Application
    Filed: August 9, 2024
    Publication date: December 5, 2024
    Inventors: Radesh Jewram, Matthew Bren, Ryan Verhulst
  • Publication number: 20220380547
    Abstract: A thermal interface material delivered as a single-component precursor mixture which reacts to form a soft, solid material. Thermally conductive particles are dispersed in the reactive polymer matrix resulting in a composite material with high thermal conductivity. A reaction inhibitor is provided so that the one-component system is stable in storage and handling at room temperature, and curable at an elevated temperature. The uncured precursor material is easily dispensed using conventional single-component automated pumping equipment, and subsequently cured in place.
    Type: Application
    Filed: May 19, 2022
    Publication date: December 1, 2022
    Inventors: Ryan Verhulst, Radesh Jewram, Reid J. Chesterfield