Patents by Inventor Ryan Vrabel

Ryan Vrabel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260133073
    Abstract: A (e.g., dissolution) testing system has one or more stationary reader units and one or more corresponding rotatable shaft assemblies. Each reader unit has reader circuitry electrically connected to a reader antenna. Each shaft assembly has shaft circuitry electrically connected to a temperature sensor and a shaft antenna. The reader circuitry controls the reader antenna to wirelessly convey electrical energy to the shaft circuitry via the shaft antenna. The shaft circuitry controls the shaft antenna based on temperature measurements from the temperature sensor to wirelessly convey corresponding temperature information to the reader circuitry via the reader antenna. The testing system may employ a Near-Field Communication protocol to convey both the electrical energy and the temperature information.
    Type: Application
    Filed: November 14, 2024
    Publication date: May 14, 2026
    Applicant: Distek, Inc.
    Inventors: Wenyu Wang, Ryan Vrabel, Jeff Watkins, Jeff Brinker, Joey Yangco
  • Publication number: 20260036514
    Abstract: A fiber-optic transmission probe system for, for example, dissolution testing, includes a single probe, a single probe tip, and a number of pathlength adjusters of different lengths. The transmission probe system is usable to assemble different probe assemblies having different, desired optical pathlengths, where each probe assembly has either no pathlength adjuster or a different one of the pathlength adjusters. The probe system avoids the prior-art requirements of having either (i) multiple probes of different, fixed optical pathlengths or (ii) a probe with multiple probe tips of different, fixed lengths to achieve the different, desired optical pathlengths.
    Type: Application
    Filed: August 2, 2024
    Publication date: February 5, 2026
    Applicant: Distek, Inc.
    Inventors: Ishai Nir, Jeff Seely, Ryan Vrabel