Abstract: A test artifact for additive manufacturing is provided. The artifact comprises an additively manufactured singular continuous body between 100 cc and 6 cc in bounding box volume and between 50 cc and 3 cc in solid body. The body comprises at least three fiducials positioned for identification of locations in cross-section after sectioning of the artifact and at least three geometries that are unique from each other when exposed in cross section.

Abstract: A method for embedding a line in a substrate. A line embedding head in positioned relative to a surface of the substrate. The line from an output port in the line embedding head is output at an angle relative to the embedding head such that the line is embedded in the substrate.

Abstract: A test artifact for additive manufacturing is provided. The artifact comprises an additively manufactured singular continuous body between 100 cc and 6 cc in bounding box volume and between 50 cc and 3 cc in solid body. The body comprises at least three fiducials positioned for identification of locations in cross-section after sectioning of the artifact and at least three geometries that are unique from each other when exposed in cross section.

Abstract: A wire embedding system and methods are presented. A wire is embedded in a substrate at predetermined locations in a series of sequential embedding instances using heat and pressure. The heat and pressure are removed from the wire in between the series of sequential embedding instances.

Abstract: A three-dimensional electronic, biological, chemical, thermal management, and/or electromechanical apparatus can be configured by depositing one or more layers of a three-dimensional structure on a substrate. Such a three-dimensional structure can include one or more internal cavities using an additive manufacturing system enhanced with a range of secondary embedding processes. The three-dimensional structure can be further configured with structural integrated metal objects spanning the internal cavities (possibly filled with air or even evacuated) of the three-dimensional structure for enhanced electromagnetic properties.

Abstract: A method of additive manufacturing is provided. The method comprises first forming a part injecting a first gas into a build chamber and depositing a first layer of metal-containing powder over a build platform. The first layer of powder is melted a laser and then cooled. The above steps can be optionally repeated to build additional layers. A coating is formed on the surface of the part by injecting a second, different gas into the chamber over the surface of the part. A portion of the surface is selectively heated with a second laser device, thereby chemically altering the heated portion to form the coating. After forming the coating, an additional aliquot of the first gas is injected into the chamber while venting the second gas from the chamber.

Abstract: Methods and systems for diagnosing and controlling material deposition during a material extrusion 3D printing process. A current sensor can measure a current signal consumed by a material feed motor. The current signal can be analyzed in the time domain and frequency domain to detect material deposition characteristics and prescribe process parameter changes.

Abstract: Methods and systems comprise new design procedures that can be implemented for additive manufacturing technologies that involve evaluation of stress concentration sites using finite element analysis and implementation of scanning strategies during fabrication that improve performance by spatially adjusting thermal energy at potential failure sites or high stress regions of a part.

Abstract: An apparatus, system, and method for automatically dispensing and embedding components into three-dimensional parts. In an example embodiment, a direct wire embedding head can be fixed on an automation motion system. The direct wire embedding head begins and terminates an embedded wire pattern on a layer or on a surface of a three-dimensional part in order to automatically create the embedded wire pattern. A sensor is located on an embedding surface wherein the embedded wire pattern is embedded. The sensor can measure the distance between the direct wire embedding head and the embedding surface. A predefined distance can be maintained to ensure successful embedding results for the embedded wire pattern by automatically adjusting a position of the direct wire embedding head in response to feedback from the sensor.

Abstract: A three-dimensional electronic, biological, chemical, thermal management, or electromechanical apparatus and method of configuring such an apparatus. In an example embodiment, an apparatus can include a substrate and one or more layers of a three-dimensional structure configured on and/or from the substrate. The three-dimensional structure includes one or more internal cavities configured by an extrusion-based additive manufacturing system enhanced with a range of secondary embedding processes. The three-dimensional structure can be configured with one or more structural integrated metal objects spanning one or more of the internal cavities of the three-dimensional structure for enhanced electromagnetic properties.

Abstract: A three-dimensional electronic, biological, chemical, thermal management, and/or electromechanical apparatus can be configured by depositing one or more layers of a three-dimensional structure on a substrate. Such a three-dimensional structure can include one or more internal cavities using an additive manufacturing system enhanced with a range of secondary embedding processes. The three-dimensional structure can be further configured with structural integrated metal objects spanning the internal cavities (possibly filled with air or even evacuated) of the three-dimensional structure for enhanced electromagnetic properties.

Abstract: A wire embedding system and methods are presented. A wire is embedded in a substrate at predetermined locations in a series of sequential embedding instances using heat and pressure. The heat and pressure are removed from the wire in between the series of sequential embedding instances.

Abstract: A three-dimensional electronic, biological, chemical, thermal management, and/or electromechanical apparatus can be configured by depositing one or more layers of a three-dimensional structure on a substrate. Such a three-dimensional structure can include one or more internal cavities using an additive manufacturing system enhanced with a range of secondary embedding processes. The three-dimensional structure can be further configured with structural integrated metal objects spanning the internal cavities (possibly filled with air or even evacuated) of the three-dimensional structure for enhanced electromagnetic properties.

Abstract: Methods and systems for manufacturing a three-dimensional product. Fabrication of a three-dimensional part from a powder spread over a work table as a powder bed can be initiated. The fabrication process can be paused to cool down the work table to room temperature to obtain access to the three-dimensional part for post-processing operations such as, for example, embedding external artifacts. Fabrication can continue by preheating the powder rather than the work table until fabrication of the three-dimensional part is complete. A damaged part may be placed within the powder bed, wherein the fabrication process can be directly initiated to achieve part repair. Additionally, a material of the same part's composition can be used or a different material utilized to render the part better than new. Access to the three-dimensional part allows embedding of a foreign object in the three-dimensional part within the powder bed while the three-dimensional part remains non-finished.

Abstract: An electronic gaming die includes an enclosure, a flexible substrate, a number of light emitting diodes, a sensor, a processor and a battery. The enclosure has N sides where N is equal to or greater than 4. The flexible substrate folds into N sides and fits into an interior of the enclosure, wherein each side has an inner face, an outer face and is assigned an integer from 1 to N. The light emitting diodes are disposed on the outer face of each side of the flexible substrate, wherein the number of light emitting diodes equals the integer assigned to the side of the flexible substrate. The sensor, processor and battery are disposed on one of the inner faces of the flexible substrate.

Abstract: A three-dimensional electronic, biological, chemical, thermal management, or electromechanical apparatus and method thereof. One or more layers of a three-dimensional structure are deposited on a substrate. The three-dimensional structure is configured to include one or more internal cavities using, an extrusion-based additive manufacturing system enhanced with a range of secondary embedding processes. The three-dimensional structure includes one or more structural integrated metal objects spanning the one or more of the internal cavities of the three-dimensional structure for enhanced electromagnetic properties and bonded between two or more other metal objects located at the same layer or different layers of the three-dimensional structure.

Abstract: A three-dimensional electronic, biological, chemical, thermal management, or electromechanical apparatus and method of configuring such an apparatus. In an example embodiment, an apparatus can include a substrate and one or more layers of a three-dimensional structure configured on and/or from the substrate. The three-dimensional structure includes one or more internal cavities configured by an extrusion-based additive manufacturing system enhanced with a range of secondary embedding processes. The three-dimensional structure can be configured with one or more structural integrated metal objects spanning one or more of the internal cavities of the three-dimensional structure for enhanced electromagnetic properties.

Abstract: An electronic gaming die includes an enclosure, a flexible substrate, a number of light emitting diodes, a sensor, a processor and a battery. The enclosure has N sides where N is equal to or greater than 4. The flexible substrate folds into N sides and fits into an interior of the enclosure, wherein each side has an inner face, an outer face and is assigned an integer from 1 to N. The light emitting diodes are disposed on the outer face of each side of the flexible substrate, wherein the number of light emitting diodes equals the integer assigned to the side of the flexible substrate. The sensor, processor and battery are disposed on one of the inner faces of the flexible substrate.

Abstract: A method for embedding a line in a substrate. A line embedding head in positioned relative to a surface of the substrate. The line from an output port in the line embedding head is output at an angle relative to the embedding head such that the line is embedded in the substrate.

Abstract: An electronic gaming die includes an enclosure, a flexible substrate, a number of light emitting diodes, a sensor, a processor and a battery. The enclosure has N sides where N is equal to or greater than 4. The flexible substrate folds into N sides and fits into an interior of the enclosure, wherein each side has an inner face, an outer face and is assigned an integer from 1 to N. The light emitting diodes are disposed on the outer face of each side of the flexible substrate, wherein the number of light emitting diodes equals the integer assigned to the side of the flexible substrate. The sensor, processor and battery are disposed on one of the inner faces of the flexible substrate.