Patents by Inventor Ryan William Hunter

Ryan William Hunter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240240879
    Abstract: A heat exchanger can comprise: a housing; a heat transfer region disposed within the housing; and an inlet manifold or an inlet conduit defined at least partially by an interior surface extending axially from a first end of the heat exchanger to an inlet defined by the heat transfer region, the inlet manifold or the inlet conduit comprising a dimple configuration disposed in the interior surface. The heat exchanger can further comprise an outlet manifold or an outlet conduit including a dimple configuration disposed on an interior surface of the outlet manifold or outlet conduit.
    Type: Application
    Filed: January 12, 2023
    Publication date: July 18, 2024
    Applicant: Raytheon Technologies Corporation
    Inventors: Orin G. Avidane, Javier A. Cue, Ryan William Hunter