Abstract: A lighting module with an efficient heatsink. The heatsink may include a base conducting portion, side fins, and a center structure. The side fins may extend away from the base portion in such a way that the distance between the fins and the center structure may vary as they may extend away from the base portion. Warm air near the base conducting portion may rise due to natural convection buoyancy, in which vertical narrowing passages may result in the passive air flow increasing in velocity as it may travel near the narrowing surface area of the heatsink improving heat transfer, and as the side fins and center structure air passages widen, the air velocity may reduce as the warm air may be distributed above heatsink.

Abstract: A lighting module with an efficient heatsink. The heatsink may include a base conducting portion, side fins, and a center structure. The side fins may extend away from the base portion in such a way that the distance between the fins and the center structure may vary as they may extend away from the base portion. Warm air near the base conducting portion may rise due to natural convection buoyancy, in which vertical narrowing passages may result in the passive air flow increasing in velocity as it may travel near the narrowing surface area of the heatsink improving heat transfer, and as the side fins and center structure air passages widen, the air velocity may reduce as the warm air may be distributed above heatsink.

Abstract: A light weight lighting module and devices including the same are disclosed. The module includes a printed circuit board with a first side and a second side, each including a conductive layer disposed thereon. The printed circuit board also includes thermal vias disposed therein, in thermal contact with the conductive layers on the first and second sides. One or more light sources are attached to the first side of the printed circuit board, such as high power light emitting diodes or laser light sources. A heat sink is attached to the second side of the printed circuit board. The light source(s) and heat sink are in thermal contact with the thermal vias of the printed circuit board so that thermal energy from the light source(s) can be transferred to the heat sink. The thermally-conductive layers and heat sink remain electrically isolated from the light source(s).