Abstract: Described herein is a method for removing deposits off a surface of a chamber component. The method includes receiving a chamber component, and fixing the chamber component in a fixture. A slurry is then applied to a surface of the chamber component, where the slurry has a pH of about 5 to about 9. The surface is then polished using a polish pad and the slurry. The surface roughness of the surface after polishing is within about 10% of the surface roughness before polishing, and wherein deposits on the surface of the chamber component are removed by polishing. An alternative method for removing deposits is also presented, wherein the chamber component is heated to a temperature of about 500° C. to about 1500° C.