Abstract: A vehicle front structure comprises a beam member positioned in front of a sub frame and having a closed-cross section extending in a vehicle width direction and a plate member extending forwardly from the beam member. The plate member comprises a fixation portion fixed to the beam member, a body portion extending forwardly from the fixation portion, and a front end portion positioned at a front end of the body portion and configured to have higher rigidity against a load applied in a longitudinal direction than the body portion. The front end portion of the plate member comprises an upper section located at a higher level than the body portion and a lower section located at a lower level than the body portion. The upper section is positioned on a vehicle forward side of the lower section.

Abstract: A vehicle front structure comprises a beam member and a plate member. The plate member comprises a vertical face portion, a body portion extending forwardly from the vertical face portion, a front end portion positioned at a front end of the body portion, and a protrusion face portion provided to be forwardly spaced apart from the vertical face portion. The front end portion comprises an upper section located at a higher level than the body portion. The protrusion face portion comprises a protrusion-face-portion upper section located at a higher level than an upper end of the upper section and a protrusion-face-portion lower section located at a lower level than the upper end of the upper section. The protrusion-face-portion lower section is configured to have lower strength against a collision load applied from a vehicle forward side than the protrusion-face-portion upper section.

Abstract: A wiring substrate includes first conductor pads formed on a surface of an insulating layer, second conductor pads formed on the surface of the insulating layer, a second insulating layer covering the surface of the insulating layer and first and second conductor pads, first via conductors formed in first via holes penetrating through the second insulating layer such that the first via conductors are formed on the first conductor pads, and second via conductors formed in second via holes penetrating through the second insulating layer such that the second via conductors are formed on the second conductor pads. The first and second conductor pads are formed such that an annular width amount of each second conductor pad is smaller than an annular width amount of each first conductor pad and that a haloing amount in each second conductor pad is smaller than a haloing amount in each first conductor pad.

Abstract: A method for manufacturing a wiring substrate includes forming conductor pads on a surface of an insulating layer, positioning, on or in the insulating layer, an electronic component having electrode pads, forming a second insulating layer covering the surface of the insulating layer, conductor pads and electronic component, forming first via holes exposing the conductor pads, applying a first desmear treatment to the second insulating layer such that residues are removed from the first via holes, forming second via holes in the second insulating layer after the first desmear treatment such that the second via holes expose the electrode pads of the electronic component positioned on or in the insulating layer, applying a second desmear treatment to the second insulating layer such that residues are removed from the second via holes, forming first via conductors in the first via holes, and forming second via conductors in the second via holes.

Abstract: A wiring substrate includes an insulating layer including a first layer and a second layer, and a conductor layer including a metal film formed on a surface of the second layer of the insulating layer such that the conductor layer includes a conductor pattern. The first layer includes resin and first inorganic particles, the second layer includes resin and second inorganic particles at the content rate that is lower than the content rate of the first inorganic particles in the first layer, and the thickness of the first layer is 90% or more of the thickness of the insulating layer. The second layer of the insulating layer includes a composite layer having the thickness in the range of 0.1 to 0.3 ?m, and the composite layer includes part of the metal film in the conductor layer formed in gaps between the second inorganic particles and resin in the second layer.

Abstract: A method for manufacturing a wiring substrate includes forming conductor pads on a surface of an insulating layer, positioning, on or in the insulating layer, an electronic component having electrode pads, forming a second insulating layer covering the surface of the insulating layer, conductor pads and electronic component, forming first via holes exposing the conductor pads, applying a first desmear treatment to the second insulating layer such that residues are removed from the first via holes, forming second via holes in the second insulating layer after the first desmear treatment such that the second via holes expose the electrode pads of the electronic component positioned on or in the insulating layer, applying a second desmear treatment to the second insulating layer such that residues are removed from the second via holes, forming first via conductors in the first via holes, and forming second via conductors in the second via holes.

Abstract: A wiring substrate includes first conductor pads formed on a surface of an insulating layer, second conductor pads formed on the surface of the insulating layer, a second insulating layer covering the surface of the insulating layer and first and second conductor pads, first via conductors formed in first via holes penetrating through the second insulating layer such that the first via conductors are formed on the first conductor pads, and second via conductors formed in second via holes penetrating through the second insulating layer such that the second via conductors are formed on the second conductor pads. The first and second conductor pads are formed such that an annular width amount of each second conductor pad is smaller than an annular width amount of each first conductor pad and that a haloing amount in each second conductor pad is smaller than a haloing amount in each first conductor pad.

Abstract: A wiring substrate includes an insulating layer including inorganic filler particles and resin, and a conductor layer including a metal film formed on a surface of the insulating layer and having a conductor pattern. The inorganic filler particles include first inorganic filler particles such that each of the first inorganic filler particles has a portion exposed on the surface of the insulating layer and is at least partially separated from the resin, the conductor layer is formed such that a part of the metal film is between the first inorganic filler particles and the resin from the surface of the insulating layer and that a distance between the surface of the insulating layer and the surface of the insulating layer at a deepest part of the part of the metal film is in the range of 0.1 ?m to 0.5 ?m.

Abstract: A vehicle front structure comprises a beam member positioned in front of a sub frame and having a closed-cross section extending in a vehicle width direction and a plate member extending forwardly from the beam member. The plate member comprises a fixation portion fixed to the beam member, a body portion extending forwardly from the fixation portion, and a front end portion positioned at a front end of the body portion and configured to have higher rigidity against a load applied in a longitudinal direction than the body portion. The front end portion of the plate member comprises an upper section located at a higher level than the body portion and a lower section located at a lower level than the body portion. The upper section is positioned on a vehicle forward side of the lower section.

Abstract: A vehicle front structure comprises a beam member and a plate member. The plate member comprises a vertical face portion, a body portion extending forwardly from the vertical face portion, a front end portion positioned at a front end of the body portion, and a protrusion face portion provided to be forwardly spaced apart from the vertical face portion. The front end portion comprises an upper section located at a higher level than the body portion. The protrusion face portion comprises a protrusion-face-portion upper section located at a higher level than an upper end of the upper section and a protrusion-face-portion lower section located at a lower level than the upper end of the upper section. The protrusion-face-portion lower section is configured to have lower strength against a collision load applied from a vehicle forward side than the protrusion-face-portion upper section.

Abstract: According to the conventional knowledge, a thermal humidity measurement device has problems in which the direction of air flow is limited to one direction is too hard to handle in securing the humidity responsiveness because there are limitations on the mounting direction of the thermal humidity measurement device and the state of air flow. An introduction guide protrudes from an air introduction surface to the outside of a measurement chamber, is parallel to a humidity introduction port surface, and has a portion not in contact with an inlet surface of a humidity introduction tube as seen from any direction to guide the flow of air to the humidity introduction tube from any direction of 360°.

Abstract: A thermal humidity measuring device includes first and second heating elements, and is capable of obtaining a plurality of measurement values (measured values) by effectively utilizing each of the heating elements, which includes measuring humidity by the first heating element. A thermal humidity measuring device includes a first bridge circuit that includes a first heating element that senses humidity, and a second bridge circuit that includes a second heating element that heats air around the first heating element. In the thermal humidity measuring device, a first output signal is extracted from the first bridge circuit, and the humidity is sensed. A second output signal is extracted from the second bridge circuit, and the second output signal includes information relating to at least any one of pressure, an air flow rate, and air temperature.

Abstract: Provided is a sensor element that can be manufactured without using hydrofluoric acid or hot phosphoric acid solution. A sensor element 100 includes a base material 10 and a semiconductor chip 20 bonded to the base material 10. The semiconductor chip 20 includes a semiconductor substrate 21, a support film 22 provided on a surface 21a of the semiconductor substrate 21, and a substrate chamber 23 provided in a concave shape on the semiconductor substrate 21 to form a cavity facing an element region 22A of the support film 22, an insulating layer 24 provided on a rear surface 21b of the semiconductor substrate 21, and a bonding layer 25 provided between the insulating layer 14 and the base material 10. The insulating layer 24 includes at least one of a silicon oxynitride film and a silicon oxide film. The bonding layer 25 includes a low-melting point glass.

Abstract: According to the conventional knowledge, a thermal humidity measurement device has problems in which the direction of air flow is limited to one direction is too hard to handle in securing the humidity responsiveness because there are limitations on the mounting direction of the thermal humidity measurement device and the state of air flow. An introduction guide protrudes from an air introduction surface to the outside of a measurement chamber, is parallel to a humidity introduction port surface, and has a portion not in contact with an inlet surface of a humidity introduction tube as seen from any direction to guide the flow of air to the humidity introduction tube from any direction of 360°.

Abstract: It is an object of the present invention to provide a thermal humidity measuring device that has a configuration including a first heating element and a second heating element and that is capable of obtaining a plurality of measurement values (measured values) including humidity measured by the first heating element, by effectively utilizing each of the heating elements. A thermal humidity measuring device 1 includes a first bridge circuit 2 that includes a first heating element 4 that senses humidity, and a second bridge circuit 3 that includes a second heating element 10 that heats air around the first heating element 4. In the thermal humidity measuring device 1, a first output signal Va5 is extracted from the first bridge circuit 2, and the humidity is sensed. A second output signal Va15 is extracted from the second bridge circuit 3, and the second output signal Va15 includes information relating to at least any one of pressure, an air flow rate, and air temperature.

Abstract: Provided is a humidity measuring apparatus that can measure a humidity of gas with high accuracy even in an environment with pulsation of gas to be measured, in measuring a humidity of gas with a humidity measuring apparatus using a thermal humidity detecting element. The humidity detecting element is disposed in a space offset from an extension line of a pressure introduction passage in a storage chamber, or a space formed on a depth side of a member provided on an extension line of the pressure introduction passage in the storage chamber such that gas introduced from a pressure introduction port into the pressure introduction passage is bent at least once before reaching the humidity detecting element.

Abstract: A thermal-type flow meter for representing a flow rate of air by the frequency of a periodic signal, wherein abnormalities in the waveform of an output signal due to frequency variation is prevented while high-frequency noise is suppressed. The thermal-type flow meter pertaining to the present invention is provided with a plurality of switching elements connected in parallel, and varies a delay width between the switching elements in accordance with variation of the frequency of a periodic signal for representing a flow rate.

Abstract: A thermal-type flow meter for representing a flow rate of air by the frequency of a periodic signal, wherein abnormalities in the waveform of an output signal due to frequency variation is prevented while high-frequency noise is suppressed. The thermal-type flow meter pertaining to the present invention is provided with a plurality of switching elements connected in parallel, and varies a delay width between the switching elements in accordance with variation of the frequency of a periodic signal for representing a flow rate.

Abstract: A vehicle comprises a bumper reinforcement extending in a vehicle width direction and a shock absorbing member fixed to a front face of the bumper reinforcement and extending in the vehicle width direction along the bumper reinforcement. The shock absorbing member comprises a base portion extending vertically along the front face of the bumper reinforcement and a projection portion extending forward from a lower end portion of the base portion and being resiliently-downward deformable relative to the base portion. Thus, the vehicle comprising the shock absorbing member provided in front of the bumper reinforcement with the leg-flicking function for the pedestrian protection can be provided.

Abstract: A power-supply control device includes a power-supply-state transition control section, body-capable-of-movement detection sections, and an instruction section. The power-supply-state transition control section shifts a state of an operation target section from one state to another state among power-supply states and a non-power-supply state. The body-capable-of-movement detection sections detect a body capable of movement in a region. The instruction section provides, on the basis of results of detection of the body capable of movement by the body-capable-of-movement detection sections, at least an instruction for shifting between one of the power-supply states and the non-power-supply state, among instructions for shifting the state of the operation target section from one state to another state with the power-supply-state transition control section.