Patents by Inventor Ryo AWANE

Ryo AWANE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11964462
    Abstract: The present invention provides an electrical debonding type adhesive sheet capable of producing a joined body in which a voltage can be stably applied to an electrical debonding type adhesive layer. An electrical debonding type adhesive sheet according to a first embodiment of the present invention includes a first adhesive layer, a substrate for voltage application including an electroconductive layer and a base layer, and a second adhesive layer in this order, and has a first protrudent part, in which the first adhesive layer and the substrate for voltage application extend and protrude with respect to the second adhesive layer, and a second protrudent part, in which the substrate for voltage application extends from the first protrudent part and protrudes with respect to the first adhesive layer.
    Type: Grant
    Filed: March 6, 2023
    Date of Patent: April 23, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventors: Kaori Akamatsu, Kaori Mizobata, Ryo Awane, Akira Hirao, Junji Yokoyama, Yosuke Shimizu
  • Publication number: 20230256710
    Abstract: The present invention provides an electrical debonding type adhesive sheet capable of producing a joined body in which a voltage can be stably applied to an electrical debonding type adhesive layer. An electrical debonding type adhesive sheet according to a first embodiment of the present invention includes a first adhesive layer, a substrate for voltage application including an electroconductive layer and a base layer, and a second adhesive layer in this order, and has a first protrudent part, in which the first adhesive layer and the substrate for voltage application extend and protrude with respect to the second adhesive layer, and a second protrudent part, in which the substrate for voltage application extends from the first protrudent part and protrudes with respect to the first adhesive layer.
    Type: Application
    Filed: March 6, 2023
    Publication date: August 17, 2023
    Inventors: Kaori AKAMATSU, Kaori MIZOBATA, Ryo AWANE, Akira HIRAO, Junji YOKOYAMA, Yosuke SHIMIZU
  • Patent number: 11623429
    Abstract: The present invention provides an electrical debonding type adhesive sheet capable of producing a joined body in which a voltage can be stably applied to an electrical debonding type adhesive layer. An electrical debonding type adhesive sheet according to a first embodiment of the present invention includes a first adhesive layer, a substrate for voltage application including an electroconductive layer and a base layer, and a second adhesive layer in this order, and has a first protrudent part, in which the first adhesive layer and the substrate for voltage application extend and protrude with respect to the second adhesive layer, and a second protrudent part, in which the substrate for voltage application extends from the first protrudent part and protrudes with respect to the first adhesive layer.
    Type: Grant
    Filed: March 6, 2019
    Date of Patent: April 11, 2023
    Assignee: NITTO DENKO CORPORATION
    Inventors: Kaori Akamatsu, Kaori Mizobata, Ryo Awane, Akira Hirao, Junji Yokoyama, Yosuke Shimizu
  • Publication number: 20220112410
    Abstract: The present invention relates to a separation and bonding method for an adherend including: a first bonding step of allowing an adhesive sheet containing at least an electrolyte-containing adhesive layer to bond to a first adherend; a first voltage application step of applying a voltage to the electrolyte-containing adhesive layer to generate a potential difference in a thickness direction of the electrolyte-containing adhesive layer in a state where the electrolyte-containing adhesive layer bonds to the first adherend; a first separation step of separating the adhesive sheet and the first adherend; and a second bonding step of allowing the adhesive sheet separated from the first adherend in the first separation step to bond to a second adherend.
    Type: Application
    Filed: September 25, 2019
    Publication date: April 14, 2022
    Inventors: Ryo AWANE, Akira HIRAO, Kaori AKAMATSU, Kaori MIZOBATA
  • Publication number: 20220032600
    Abstract: A separation method for an adherend according to the present invention allows members to firmly bond to each other by recovery of adhesive force when a predetermined time elapses after a voltage has been applied and can easily separate the adherend by applying the voltage again, and a bonding method for an adherend according to the present invention allows members to firmly bond to each other by recovery of adhesive force when a predetermined time elapses after a voltage has been applied.
    Type: Application
    Filed: September 25, 2019
    Publication date: February 3, 2022
    Inventors: Ryo AWANE, Akira HIRAO, Kaori AKAMATSU, Kaori MIZOBATA
  • Publication number: 20210002516
    Abstract: An object of a first embodiment of the present invention is to provide an electrical debonding type adhesive sheet which can be applied while inhibiting the trapping of air bubbles and while easily avoiding surface irregularities, etc., and which gives a joined body that can be easily debonded. The electrical debonding type adhesive sheet according to the first embodiment of the present invention includes a substrate for voltage application, a first adhesive layer, which is constituted of an electrically debondable adhesive and is formed on an electroconductive surface of the substrate for voltage application, and a second adhesive layer, which is formed on the opposite surface of the substrate for voltage application, the electrical debonding type adhesive sheet including a plurality of linked parts and a linking part which links the plurality of linked parts to each other.
    Type: Application
    Filed: March 6, 2019
    Publication date: January 7, 2021
    Inventors: Kaori AKAMATSU, Kaori MIZOBATA, Ryo AWANE, Akira HIRAO, Junji YOKOYAMA
  • Publication number: 20200406582
    Abstract: The present invention provides an electrical debonding type adhesive sheet capable of producing a joined body in which a voltage can be stably applied to an electrical debonding type adhesive layer. An electrical debonding type adhesive sheet according to a first embodiment of the present invention includes a first adhesive layer, a substrate for voltage application including an electroconductive layer and a base layer, and a second adhesive layer in this order, and has a first protrudent part, in which the first adhesive layer and the substrate for voltage application extend and protrude with respect to the second adhesive layer, and a second protrudent part, in which the substrate for voltage application extends from the first protrudent part and protrudes with respect to the first adhesive layer.
    Type: Application
    Filed: March 6, 2019
    Publication date: December 31, 2020
    Inventors: Kaori AKAMATSU, Kaori MIZOBATA, Ryo AWANE, Akira HIRAO, Junji YOKOYAMA, Yosuke SHIMIZU
  • Publication number: 20200002581
    Abstract: An object of the present invention is to provide an electrically debondable composition for forming an electrically debondable adhesive layer suitable for suppressing corrosion of a metal adherend surface. The present invention further provides an adhesive sheet having the electrically debondable adhesive layer, and an adhered body including the adhesive sheet. An electrically debondable composition of the present invention includes a polymer, an ionic liquid, and at least one additive selected from the group consisting of a carbodiimide compound, an adsorptive inhibitor and a chelate-forming metal deactivator.
    Type: Application
    Filed: March 1, 2018
    Publication date: January 2, 2020
    Inventors: Kaori AKAMATSU, Kaori MIZOBATA, Ryo AWANE, Koji AKAZAWA, Junji YOKOYAMA, Akira HIRAO, Yosuke SHIMIZU, Akiko TANAKA