Patents by Inventor Ryo Bamba

Ryo Bamba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polishing apparatus for semiconductor wafers
    Patent number: 6083090
    Abstract: A polishing apparatus for uniformly polishing the whole of a target surface of a semiconductor wafer includes a wafer holder for holding a wafer by adsorption and a pad to which the wafer holder is compressed while rotating. Between a rotary shaft for the apparatus and the wafer holder is a mechanism for allowing the orientation of the wafer holder to change with an increased degree of freedom. This mechanism is formed with a container filled with a liquid and attached to the lower end of the rotary shaft and an elastic member which seals the liquid in the container.
    Type: Grant
    Filed: March 16, 1999
    Date of Patent: July 4, 2000
    Assignee: Rohm Co., Ltd.
    Inventor: Ryo Bamba