Abstract: An exposure apparatus for executing an exposure of a substrate to light via a mask. The apparatus includes a booth which stores the mask in an atmospheric pressure, a processing chamber in which the exposure is executed in a first vacuum pressure, a vacuum chamber, arranged between the booth and the processing chamber, stores the mask at a second vacuum pressure that is higher than the first vacuum pressure and is between 0.1 Pa and 100 Pa, a first load lock chamber, arranged between the booth and the vacuum chamber, through which the mask is transferred, in which the atmospheric pressure and the second vacuum pressure are replaceable, and a second load lock chamber arranged between the vacuum chamber and the processing chamber, through which the mask is transferred, in which the second vacuum pressure and the first vacuum pressure are replaceable.

Abstract: A processing unit including a supply section for storing a mask having a patterned surface having a pattern to be exposed to a plate, the supply section being maintained under atmospheric pressure, a process chamber for processing the plate, the process chamber being maintained in a reduced pressure or vacuum atmosphere and the processing unit transferring the mask between the supply section and the process chamber, and a protection unit for protecting the patterned surface in a non-contact manner and for holding part of the mask other than the patterned surface. The protection unit covers the mask while opening at least a part of the other side surface of the patterned surface. The processing unit further includes a transfer unit for adsorbing the protection unit and for transferring the protection unit and the mask held by the protection unit, between the supply section and the process chamber.

Abstract: At least one exemplary embodiment is directed to an apparatus which includes an original stage, to hold an original, which moves in a scan direction, an illumination optical system configured to illuminate the original held by the original stage with exposure light, a substrate stage configured to hold a substrate and to move in a scan direction, a projection optical system configured to project a pattern of the original onto the substrate with the exposure light, and an irradiation unit configured to irradiate the original held by the original stage. Irradiation by the irradiation unit and movement of the original stage in the scan direction are carried out substantially in parallel with each other so as to remove a contaminant on the original.

Abstract: A load-lock system includes a load-lock chamber arranged between a storage port which stores a substrate and a process chamber which processes the substrate in a process space maintained at a pressure lower than that in the storage port, and a dehumidifying unit which forms a dehumidified environment in the load-lock chamber. A system preferably includes another chamber between said storage port and said load-lock chamber, wherein said dehumidifying unit dehumidifies said another chamber.

Abstract: A load lock chamber provided between a port that accommodates an object to be processed and is maintained at an ambient pressure, and a process chamber that is maintained at a reduced pressure or vacuum environment and performs a predetermined process for the object, said load lock chamber replacing an atmosphere in said load lock chamber and delivering the object between the port and the process chamber includes a first load lock chamber that includes a first holder for holding the object received from the port, and a second load lock chamber that includes a second holder for holding the object received from the process chamber, wherein the first holder holds more objects than the second holder.

Abstract: A processing unit includes a supply section for storing a mask having a pattern surface having a pattern to be exposed to a plate, the supply section being maintained under atmospheric pressure, a process chamber for processes the plate, the process chamber being maintained in a reduced pressure or vacuum atmosphere, said processing unit transferring the mask between the supply section and the process chamber, a protection unit for protecting the pattern surface in a non-contact manner and for holding part of the mask other than the pattern surface, and a transfer unit for adsorbing the protection unit and for transferring the protection unit and the mask held by the protection unit, between the supply section and the process chamber.

Abstract: A load-lock apparatus including a load-lock chamber, a chuck, arranged in the load-lock chamber, to hold a substrate, a pressure reduction system to reduce a pressure in the load-lock chamber using an exhaust valve, a pressure measurement system to measure a pressure in the load-lock chamber, and a time measurement system to measure an operating time of the pressure reduction system. The exhaust valve is controlled such that a relationship between a pressure measured by the pressure measurement system and a time measured by the time measurement system falls within a predetermined range with respect to a predetermined relationship.

Abstract: At least one exemplary embodiment is directed to an apparatus which includes an original stage, to hold an original, which moves in a scan direction, an illumination optical system configured to illuminate the original held by the original stage with exposure light, a substrate stage configured to hold a substrate and to move in a scan direction, a projection optical system configured to project a pattern of the original onto the substrate with the exposure light, and an irradiation unit configured to irradiate the original held by the original stage. Irradiation by the irradiation unit and movement of the original stage in the scan direction are carried out substantially in parallel with each other so as to remove a contaminant on the original.

Abstract: A substrate processing apparatus includes a first chamber, a second chamber which has a first valve, a second valve and a chuck, wherein a substrate is transferred to the second chamber through the first valve, held by the chuck in the second chamber, and then transferred to the first chamber through the second valve, a pressure reduction section which reduces a pressure in the second chamber to a predetermined pressure while the substrate is held by the chuck in the second chamber, a thermoregulator which is arranged in the chuck and regulates a temperature of the substrate held by the chuck to be a predetermined temperature, and a controller which controls the pressure reduction section so as to make a relationship between the pressure in the second chamber and a pressure reduction time in the second chamber fall within a predetermined range, controls the chuck so as to make a suction force for the substrate constant, and controls the thermoregulator so as to make a temperature of the chuck constant.

Abstract: A processing system includes a supplying part for storing an object to be fed and for being maintained at an atmospheric pressure a processing chamber for being maintained at a reduced pressure or vacuum atmosphere and for executing a predetermined processing to the object, the object being fed between the supplying part and the processing chamber, a vacuum chamber, arranged between the supplying part and the processing chamber, for storing the object at a pressure of 100 Pa or less, the vacuum chamber having a replaceable atmosphere, and a first load lock chamber, arranged between the supplying part and said vacuum chamber, for receiving and supplying the object between the supplying part and said vacuum chamber, the first load lock chamber having a replaceable atmosphere.

Abstract: A substrate processing system includes a process chamber having a process station for processing a substrate in an ambience different from an atmosphere, a plurality of load-lock chambers each being connected to the process chamber through an opening/closing device and connected to the atmosphere through an opening/closing device, a first conveying device for conveying the substrate between the process chamber and the load-lock chambers, and a second conveying device for conveying the substrate between a supply station in the atmosphere and the load-lock chambers. Each of the load-lock chambers is arranged so that, prior to replacement of an ambience inside the load-lock chamber, the substrate is conveyed by the first conveying device from the load-lock chamber into the process chamber and then the substrate is conveyed into the load-lock chamber.

Abstract: A load-lock system includes a load-lock chamber arranged between a storage port which stores a substrate and a process chamber which processes the substrate in a process space maintained at a pressure lower than that in the storage port, and a dehumidifying unit which forms a dehumidified environment in the load-lock chamber. A system preferably includes another chamber between said storage port and said load-lock chamber, wherein said dehumidifying unit dehumidifies said another chamber.

Abstract: A load lock chamber provided between a port that accommodates an object to be processed and is maintained at an ambient pressure, and a process chamber that is maintained at a reduced pressure or vacuum environment and performs a predetermined process for the object, said load lock chamber replacing an atmosphere in said load lock chamber and delivering the object between the port and the process chamber includes a first load lock chamber that includes a first holder for holding the object received from the port, and a second load lock chamber that includes a second holder for holding the object received from the process chamber, wherein the first holder holds more objects than the second holder.

Abstract: A substrate processing apparatus according to this invention includes a first chamber, a second chamber which has a first valve and a second valve, and communicates with the first chamber through said second valve, a thermoregulator which regulates a temperature of the substrate arranged in the second chamber, and a controller which controls a time for which the thermoregulator regulates the temperature of the substrate. A substrate transferred to the second chamber through the first valve is temporally held in the second chamber, and then transferred to the first chamber through the second valve.

Abstract: A substrate processing apparatus of this invention includes the first chamber which forms a predetermined environment such as a pressure-reduced atmosphere in its internal space, the second chamber which communicates with an external environment through the first valve, and with the first chamber through the second valve, and a thermoregulator which regulates the temperature of a substrate transferred to the second chamber. The substrate is supplied to the first chamber through the second chamber.

Abstract: A mask includes a mask substrate on which a mask pattern is formed, a frame for supporting the mask substrate, and at least one alignment mark formed on the frame. The alignment mark is used for positioning the mask substrate on the frame. The invention also includes a method for making a mask comprising the steps of forming at least one alignment mark at a predetermined position on a mask frame, forming a mask pattern on a mask substrate at a predetermined position with respect to the alignment mark, and joining the mask substrate and the mask frame to form a mask. In addition, the method can include the step of joining the mask substrate and the frame in a predetermined positional relationship on the basis of the position of the alignment mark.

Abstract: An alignment detecting method in which alignment detection for a mask and a wafer is effected by using an alignment beam projected from an alignment unit. According to this method, the attitude of the alignment unit is detected and an angle of projection of the alignment beam is adjusted o the basis of the attitude detection. Then, alignment detection for the mask and t he wafer is effected by using the angle-adjusted alignment beam.