Patents by Inventor Ryo Hirose
Ryo Hirose has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10224203Abstract: Provided is a method of producing a semiconductor epitaxial wafer having enhanced gettering ability. The method of producing a semiconductor epitaxial wafer includes: a first step of irradiating a surface of a semiconductor wafer with cluster ions to form a modified layer that is located in a surface portion of the semiconductor wafer and that includes a constituent element of the cluster ions in solid solution; and a second step of forming an epitaxial layer on the modified layer of the semiconductor wafer. The first step is performed in a state in which a temperature of the semiconductor wafer is maintained at lower than 25° C.Type: GrantFiled: November 25, 2015Date of Patent: March 5, 2019Assignee: SUMCO CORPORATIONInventors: Ryo Hirose, Ryosuke Okuyama, Kazunari Kurita
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Publication number: 20180348044Abstract: A mounting structure includes a mounting object member and a liquid level detecting device. The liquid level detecting device includes a device main body which is mounted on a mounting surface of the mounting object member and a holder which is attached to the device main body and is rotated according to a variation of a liquid level of liquid stored in a tank. The mounting object member has a pair of lock portions which lock side portions of the device main body respectively and a pair of projections. The device main body has a pair of hooks. The hooks have respective claws. The hooks are formed closer to the mounting surface in a thickness direction of the device main body than a holder movable area of the device main body.Type: ApplicationFiled: June 4, 2018Publication date: December 6, 2018Applicant: Yazaki CorporationInventors: Ryo HIROSE, Shintaro NAKAJIMA, Shinpei KATO, Shingo NOMOTO
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Publication number: 20180348046Abstract: A liquid level detecting device includes a sensor housing having a circular rotation recess, a circular holder which is fitted in the rotation recess and held rotatably by the sensor housing, a float arm, a float, a magnet, and a Hall element. The sensor housing has a lock groove and a pair of insertion holes. The holder has a pair of flanges which project in opposite directions from an outer circumferential surface of the holder and are engaged with the lock groove and prevented from coming off the rotation recess by setting the flanges opposed to the respective insertion holes, fitting the flanges into the rotation recess, and then rotating the flanges. The holder has a pair of support projections which come into contact with a bottom surface of the rotation recess.Type: ApplicationFiled: June 4, 2018Publication date: December 6, 2018Applicant: Yazaki CorporationInventors: Ryo Hirose, Shintaro Nakajima, Shinpei Kato
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Publication number: 20180348037Abstract: A liquid level detecting device includes a sensor housing, a holder which is held rotatably by the sensor housing, a float arm which is fixed to the holder, a float which is attached to a tip portion of the float arm and varies in position following a surface level of liquid stored in a tank, a magnet provided in the holder, and a Hall element which is provided in the sensor housing and detects a displacement of the magnet of the holder. The magnet is a plastic magnet in which magnetic powder and a resin are mixed. A surface of the plastic magnet is coated by a coating layer.Type: ApplicationFiled: May 3, 2018Publication date: December 6, 2018Applicant: Yazaki CorporationInventors: Shinpei KATO, Shingo NOMOTO, Ryo HIROSE
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Publication number: 20170352545Abstract: Provided is a method of producing a semiconductor epitaxial wafer having enhanced gettering ability. The method of producing a semiconductor epitaxial wafer includes: a first step of irradiating a surface of a semiconductor wafer with cluster ions to form a modified layer that is located in a surface portion of the semiconductor wafer and that includes a constituent element of the cluster ions in solid solution; and a second step of forming an epitaxial layer on the modified layer of the semiconductor wafer. The first step is performed in a state in which a temperature of the semiconductor wafer is maintained at lower than 25° C.Type: ApplicationFiled: November 25, 2015Publication date: December 7, 2017Applicant: SUMCO CORPORATIONInventors: Ryo HIROSE, Ryosuke OKUYAMA, Kazunari KURITA
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Publication number: 20150377688Abstract: A sensor includes: a Hall IC that outputs an electrical signal depending on a liquid level which is a detection object; a condenser used together with the Hall IC; a plurality of lead frames that includes a terminal portion to which a lead wire is connected, and a base portion to which a lead of the Hall IC is connected; and an inner member that holds the plurality of lead frames. In the inner member holding the lead frame, a space portion recessed in a concave shape is formed, and the Hall IC is accommodated in the space portion. Further, a condenser is mounted between a pair of the leads present in the space portion.Type: ApplicationFiled: September 9, 2015Publication date: December 31, 2015Applicant: YAZAKI CORPORATIONInventors: Toshiaki FUKUHARA, Ryo HIROSE, Shinpei KATO
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Publication number: 20150362356Abstract: A sensor housing of a fluid level sensor includes a peripheral wall portion and a lead wire inserting portion. The peripheral wall portion forms a hollow space penetrating in the depth direction of the sensor housing and is formed in a manner of surrounding the periphery of a terminal area of a lead frame. The lead wire inserting portion is formed by notching the peripheral wall portion in the depth direction of the sensor housing. The lead wire inserting portion consists of a first inserting portion into which a lead wire extending from the terminal area is inserted and a second inserting portion into which the lead wire is inserted after passing through the first inserting portion and holds the lead wire in a manner of bending the lead wire in a crank shape. With this configuration, the fluid level sensor can prevent leak current generated on the terminal area and thus can connect a conductive wire (the lead wire) used for connection with an external circuit with the terminal area in good condition.Type: ApplicationFiled: August 25, 2015Publication date: December 17, 2015Inventors: Toshiaki Fukuhara, Shinpei Kato, Ryo Hirose
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Publication number: 20150300870Abstract: A liquid surface level sensor includes a plurality of piece portions provided at both ends of the liquid surface level sensor in a width direction, and a plurality of elastically deformable hook portions formed to elongate from both end sides in a first height direction. A pump holder includes a plurality of claw portions formed in a claw shape by bending front end sides in an intra-width direction of the liquid surface level sensor, and a plurality of convex portions on a side of the first height direction of the plurality of claw portions. A plurality of hook portions is elastically deformed in contact with the plurality of convex portions by sliding the liquid surface level sensor in a second height direction, the plurality of hook portions gets over the plurality of convex portions and restores from an elastically deformed state by further sliding the liquid surface level sensor.Type: ApplicationFiled: June 30, 2015Publication date: October 22, 2015Inventors: Toshiaki Fukuhara, Shinpei Kato, Ryo Hirose
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Patent number: 9157783Abstract: A method for producing a conductive segment, includes: a step of printing a metal conductive paste on a substrate, and drying the paste; a step of printing other metal conductive paste on the metal conductive paste after drying, and drying the paste; and a step of burning the metal conductive paste after drying and the other metal conductive paste after drying, wherein the conductive metal paste is an Ag—Pd conductive paste comprising silver (Ag) and palladium (Pd), and the other metal conductive paste is an Au conductive paste comprising gold (Au) as a main component; or the metal conductive paste is an Au conductive paste comprising gold (Au) as a main component, and the other metal conductive paste is an Ag—Pd conductive paste comprising silver (Ag) and palladium (Pd).Type: GrantFiled: July 23, 2012Date of Patent: October 13, 2015Assignee: YAZAKI CORPORATIONInventors: Toshio Oike, Kenichi Tanaka, Ryo Hirose, Takafumi Shimizu
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Publication number: 20150260564Abstract: A sensor includes an electronic component having a conductive lead and a body portion, a first resin molded piece configured to receive and to hold the electronic component, a lead frame held by the first resin molded piece and electrically connected to the lead of the electronic component, and a second resin molded piece insert-molded with the electronic component, the first resin molded piece and the lead frame being insert parts such that a portion of the lead frame is exposed. The first resin molded piece has a recess portion at least in a wiring section in which the lead of the electronic component extends. The recess portion is filled with a potting material having an insulation property and an adhesiveness to the lead and to the first resin molded piece.Type: ApplicationFiled: March 16, 2015Publication date: September 17, 2015Applicant: YAZAKI CORPORATIONInventors: Shinpei KATO, Toshiaki FUKUHARA, Ryo HIROSE
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Patent number: 9062997Abstract: A liquid level detector is provided. A resistance plate has a plurality of conductive segments. A float vertically moves according to change of a liquid level to be measured. A float arm has one end attached to the float and the other end rotatably supported to rotate according to the vertical movement of the float. Contact points slide on the conductive segments with the rotation of the float arm according to the liquid level. The conductive segments are formed of a glass-sintered metallic body made of glass and gold alloy material containing a gold (Au) content equal to or greater than 18% by mass and less than 40% by mass. The contact points are formed of a gold alloy material containing a gold (Au) content equal to or greater than 32.5% by mass and less than 77% by mass.Type: GrantFiled: October 21, 2011Date of Patent: June 23, 2015Assignee: YAZAKI CORPORATIONInventors: Toshio Oike, Ryo Hirose, Masaki Hirota
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Publication number: 20130025366Abstract: A method for producing a conductive segment, includes: a step of printing a metal conductive paste on a substrate, and drying the paste; a step of printing other metal conductive paste on the metal conductive paste after drying, and drying the paste; and a step of burning the metal conductive paste after drying and the other metal conductive paste after drying, wherein the conductive metal paste is an Ag—Pd conductive paste comprising silver (Ag) and palladium (Pd), and the other metal conductive paste is an Au conductive paste comprising gold (Au) as a main component; or the metal conductive paste is an Au conductive paste comprising gold (Au) as a main component, and the other metal conductive paste is an Ag—Pd conductive paste comprising silver (Ag) and palladium (Pd).Type: ApplicationFiled: July 23, 2012Publication date: January 31, 2013Applicant: YAZAKI CORPORATIONInventors: Toshio OIKE, Kenichi TANAKA, Ryo HIROSE, Takafumi SHIMIZU
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Publication number: 20120103090Abstract: A liquid level detector is provided. A resistance plate has a plurality of conductive segments. A float vertically moves according to change of a liquid level to be measured. A float arm has one end attached to the float and the other end rotatably supported to rotate according to the vertical movement of the float. Contact points slide on the conductive segments with the rotation of the float arm according to the liquid level. The conductive segments are formed of a glass-sintered metallic body made of glass and gold alloy material containing a gold (Au) content equal to or greater than 18% by mass and less than 40% by mass. The contact points are formed of a gold alloy material containing a gold (Au) content equal to or greater than 32.5% by mass and less than 77% by mass.Type: ApplicationFiled: October 21, 2011Publication date: May 3, 2012Inventors: Toshio Oike, Ryo Hirose, Masaki Hirota
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Publication number: 20090181948Abstract: The present invention provides a diamine derivative or the like represented by the general formula (I): {wherein Q represents an oxygen atom or the like, RG represents a hydrogen atom or the like, RI represents (wherein p and r may be the same or different, and each represents 0 or the like, RA represents a hydrogen atom or the like, and RB and RC may be the same or different, and each represents a hydrogen atom or the like), RH represents a hydrogen atom or the like, and RJ represents: (wherein q and s may be the same or different, and each represents 0 or the like, RD represents a hydrogen atom or the like, and RE and RF may be the same or different, and each represents a hydrogen atom or the like) or the like}, etc.Type: ApplicationFiled: January 31, 2006Publication date: July 16, 2009Applicant: KYOWA HAKKO KOGYO CO., LTD.Inventors: Setsuya Sasho, Takashi Seishi, Eri Atsumi, Mariko Osakada, Ryo Hirose, Shinichiro Toki, Katsuyoshi Tsukii, Shiro Shirakura
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Publication number: 20060058366Abstract: The present invention provides a JNK inhibitor comprising, as an active ingredient, an indazole derivative represented by Formula (I) [wherein R1 represents substituted or unsubstituted aryl or the like and R2 represents a hydrogen atom, NR3R4 (wherein R3 and R4 may be the same or different and each represents a hydrogen atom, substituted or unsubstituted lower alkanoyl or the like), carboxy, lower alkenyl or the like] or a pharmaceutically acceptable salt thereof.Type: ApplicationFiled: December 3, 2003Publication date: March 16, 2006Applicant: KYOWA HAKKO KOGYO CO., LTD.Inventors: Fumihiko Kanai, Toshiaki Kumazawa, Jun-ichi Saito, Junichi Shimada, Ryo Hirose, Michio Ichimura