Patents by Inventor Ryo Itaya

Ryo Itaya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Curable resin composition, cured product of same and semiconductor device
    Patent number: 11124649
    Abstract: The purpose of the present invention is to provide a curable resin composition which forms a cured product having excellent heat resistance, light resistance, and flexibility. The present invention provides a curable resin composition comprising the following components: (A): a polyorganosiloxane represented by the average unit formula: (SiO4/2)a1(R1SiO3/2)a2(R12SiO2/2)a3(R13SiO1/2)a4 wherein each R1 is alkyl, aryl, alkenyl, etc., a percentage of the alkyl is 50 to 98 mol %, a percentage of the aryl is 1 to 50 mol %, and a percentage of the alkenyl is 1 to 35 mol % based on the total amount of R1, and a1>0, a2>0, a3?0, a4>0, 0.01?a1/a2?10, and a1+a2+a3+a4=1; (B) a polyorganosiloxane represented by the average composition formula: R2mHnSiO[(4-m-n)/2] wherein R2 is alkyl or aryl, and 0.7?m?2.1, 0.001?n?1.5, and 0.8?m+n?3; (C): a zirconium compound; and (D): a hydrosilylation catalyst.
    Type: Grant
    Filed: July 10, 2017
    Date of Patent: September 21, 2021
    Assignee: NICHIA CORPORATION
    Inventors: Shinya Yabuno, Ryo Itaya, Yasunobu Nakagawa
  • CURABLE RESIN COMPOSITION, CURED PRODUCT OF SAME AND SEMICONDUCTOR DEVICE
    Publication number: 20210277236
    Abstract: The purpose of the present invention is to provide a curable resin composition which forms a cured product having excellent heat resistance, light resistance, and flexibility. The present invention provides a curable resin composition comprising the following components: (A): a polyorganosiloxane represented by the average unit formula: (SiO4/2)a1(R1SiO3/2)a2(R12SiO2/2)a3(R13SiO1/2)a4 wherein each R1 is alkyl, aryl, alkenyl, etc., a percentage of the alkyl is 50 to 98 mol %, a percentage of the aryl is 1 to 50 mol %, and a percentage of the alkenyl is 1 to 35 mol % based on the total amount of R1, and a1>0, a2>0, a3?0, a4>0, 0.01?a1/a2?10, and a1+a2+a3+a4=1; (B) a polyorganosiloxane represented by the average composition formula: R2mHnSiO[(4-m-n)/2] wherein R2 is alkyl or aryl, and 0.7?m?2.1, 0.001?n?1.5, and 0.8?m+n?3; (C): a zirconium compound; and (D): a hydrosilylation catalyst.
    Type: Application
    Filed: July 10, 2017
    Publication date: September 9, 2021
    Applicant: NICHIA CORPORATION
    Inventors: Shinya YABUNO, Ryo ITAYA, Yasunobu NAKAGAWA
  • Curable resin composition, cured product thereof, and semiconductor device
    Patent number: 10870758
    Abstract: An object of the present invention is to provide a curable resin composition for forming a less tacky cured product, having excellent gas barrier properties and heat and light resistance. This curable resin composition comprises the following components (A), (B), and (C): (A): a polyorganosiloxane represented by the following average unit formula: (SiO4/2)a1(R1SiO3/2)a2(R12SiO2/2)a3(R13SiO1/2)a4 wherein each R1 is alkyl, aryl, alkenyl, etc., a percentage of the alkyl is 50 to 98 mol %, a percentage of the aryl is 1 to 50 mol %, and a percentage of the alkenyl is 1 to 35 mol % based on the total amount of R1, and a1>0, a2>0, a3?0, a4>0, 0.5?a1/a2?10, and a1+a2+a3+a4=1; (B) a polyorganosiloxane represented by the following average composition formula: R2mHnSiO[(4?m?n)/2] wherein R2 is alkyl or aryl, and 0.7?m?2.1, 0.001?n?1.0, and 0.8?m+n?3; and (C): a hydrosilylation catalyst.
    Type: Grant
    Filed: February 20, 2017
    Date of Patent: December 22, 2020
    Assignee: DAICEL CORPORATION
    Inventors: Shinya Yabuno, Ryo Itaya, Shigeaki Kamuro, Yasunobu Nakagawa
  • CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND SEMICONDUCTOR DEVICE
    Publication number: 20200048460
    Abstract: An object of the present invention is to provide a curable resin composition for forming a less tacky cured product, having excellent gas barrier properties and heat and light resistance. This curable resin composition comprises the following components (A), (B), and (C): (A): a polyorganosiloxane represented by the following average unit formula: (SiO4/2)a1(R1SiO3/2)a2(R12SiO2/2)a3(R13SiO1/2)a4 wherein each R1 is alkyl, aryl, alkenyl, etc., a percentage of the alkyl is 50 to 98 mol %, a percentage of the aryl is 1 to 50 mol %, and a percentage of the alkenyl is 1 to 35 mol % based on the total amount of R1, and a1>0, a2>0, a3?0, a4>0, 0.5?a1/a2?10, and a1+a2+a3+a4=1; (B) a polyorganosiloxane represented by the following average composition formula: R2mHnSiO[(4?m?n)/2] wherein R2 is alkyl or aryl, and 0.7?m?2.1, 0.001?n?1.0, and 0.8?m+n?3; and (C): a hydrosilylation catalyst.
    Type: Application
    Filed: February 20, 2017
    Publication date: February 13, 2020
    Applicant: DAICEL CORPORATION
    Inventors: Shinya YABUNO, Ryo ITAYA, Shigeaki KAMURO, Yasunobu NAKAGAWA
  • Thin-film materials, thin films and producing method thereof
    Publication number: 20090004508
    Abstract: An N-substituted benzimidazole-containing bridged alicyclic compound is provided.
    Type: Application
    Filed: June 9, 2008
    Publication date: January 1, 2009
    Inventors: Yoshinori Funaki, Ryo Itaya, Akira Takaragi, Kazuki Okamoto, Mayumi Torieda