Patents by Inventor Ryo Izumi

Ryo Izumi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DRIVER ASSIST APPARATUS
    Publication number: 20210107359
    Abstract: The driver assist apparatus comprises an ECU. When a customization button is touched while the ECU is displaying a surrounding monitoring screen that includes a surrounding image and the customization button, the ECU starts displaying a customization screen in place of the surrounding monitoring screen. When a predetermined condition is satisfied while the ECU is displaying the customization screen, the ECU starts displaying an alert screen in place of the customization screen.
    Type: Application
    Filed: October 9, 2020
    Publication date: April 15, 2021
    Applicant: Toyota Jidosha Kabushiki Kaisha
    Inventors: Toshihiro Takagi, Yasutaka Matsunaga, Ryo Izumi
  • Solder composition and electronic board
    Patent number: 10449638
    Abstract: A solder composition of the invention includes: a flux composition containing a component (A) in a form of a rosin-based resin, a component (B) in a form of an activator, a component (C) in a form of a solvent and a component (D) in a form of a thixotropic agent; and a component (E) in a form of a solder powder. The component (C) in a form of the solvent contains a component (C1) in a form of a isobornyl cyclohexanol and a component (C2) in a form of a solvent whose viscosity at 20 degrees C. is 10 mPa·s or less and whose boiling point ranges from 220 degrees C. to 245 degrees C.
    Type: Grant
    Filed: March 28, 2017
    Date of Patent: October 22, 2019
    Assignee: TAMURA CORPORATION
    Inventors: Daigo Ichikawa, Ryo Izumi, Mitsuru Iwabuchi, Nobuhiro Yamashita, Kenta Fukuda, Satoshi Okumura, Nobuo Tajima
  • SOLDER COMPOSITION AND ELECTRONIC BOARD
    Publication number: 20170282304
    Abstract: A solder composition of the invention includes: a flux composition containing a component (A) in a form of a rosin-based resin, a component (B) in a form of an activator, a component (C) in a form of a solvent and a component (D) in a form of a thixotropic agent; and a component (E) in a form of a solder powder. The component (C) in a form of the solvent contains a component (C1) in a form of a isobornyl cyclohexanol and a component (C2) in a form of a solvent whose viscosity at 20 degrees C. is 10 mPa·s or less and whose boiling point ranges from 220 degrees C. to 245 degrees C.
    Type: Application
    Filed: March 28, 2017
    Publication date: October 5, 2017
    Inventors: Daigo Ichikawa, Ryo Izumi, Mitsuru Iwabuchi, Nobuhiro Yamashita, Kenta Fukuda, Satoshi Okumura, Nobuo Tajima